SY88212L_10 Datasheet, PDF (4/10 Pages) Micrel Semiconductor – 3.3V, 2.5Gbps Laser Diode Driver

Micrel, Inc.
SY88212L
Absolute Maximum Ratings⁽¹⁾
Supply Voltage (V_CC) .................................... –0.5V to +4.0V
CML Input Voltage (V_IN) ....................V_CC–1.2V to V_CC+0.5V
TTL Control Input Voltage (V_I).....................0V to V_CC +0.3V
Lead Temperature (soldering, 20sec.) ..................... +260°C
Storage Temperature (T_s) ......................... –65°C to +150°C
Operating Ratings⁽²⁾
Supply Voltage (V_CC).................................... +3.0V to +3.6V
Ambient Temperature (T_A) .......................... –40°C to +85°C
Package Thermal Resistance⁽³⁾
QFN
(θ_JA) Still-air........................................................50°C/W
(ψ_JB) ................................................................... 30°C/W
DC Electrical Characteristics
T_A = –40°C to +85°C and V_CC = +3.0V to +3.6V. Unless otherwise noted, typical values are V_CC = +3.3V,
T_A = 25°C, I_MOD = 25mA, I_BIAS = 20mA.
Symbol
ICC
Parameter
Power Supply Current
Condition
Min
Typ
Max
Units
Modulation and Bias currents
excluded
55
95⁽⁴⁾
mA
VMOD_MIN
Minimum Voltage Required at the
Driver Output, MOD+ and MOD-,
for Proper Operation
0.6
V
VBIAS_MIN
Minimum Voltage Required at the
Driver Output, BIAS+ and BIAS-,
for Proper Operation
0.8
V
IBIAS
Bias-ON Current
Voltage at Bias pin ≥ 0.8V
1
70
mA
IBIAS_OFF
Bias-OFF Current
Current at BIAS pin when /EN
is high or TXDISABLE is High
150
µA
RIN
Input Resistance at DIN+ and DIN- Single ended
42.5
50
57.5
Ω
VDIFF-IN (DIN) Differential Input Voltage Swing
100
2400
mVPP
VOL
APCFAULT Output Low
IOL = 2mA
0.5
V
IOH
APCFAULT Output Leakage
VOH = VCC
100
µA
VIH
High Voltage /EN, TXDISABLE,
/TXDISABLE
2
V
VIL
Low Voltage /EN, TXDISABLE,
/TXDISABLE
0.8
V
VPWRMON
Maximum voltage at PWRMON pin
1.25
V
IMD
Current range at MD pin
50
1500
µA
Notes:
1. Permanent device damage may occur if absolute maximum ratings are exceeded. This is a stress rating only and functional operation is not implied
at conditions other than those detailed in the operational sections of this data sheet. Exposure to absolute maximum ratings conditions for extended
periods may affect device reliability.
2. The data sheet limits are not guaranteed if the device is operated beyond the operating ratings.
3. Package Thermal Resistance assumes exposed pad is soldered (or equivalent) to the devices most negative potential on the PCB. ψJB uses a
4-layer and θJA in still air unless otherwise stated.
4. ICC = 95mA for worst-case conditions with IMOD = 85mA, IBias = 70mA, TA = +85°C, VCC = 3.6V.
April 2008
4
M9999-040908-A
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