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SM844256 Datasheet, PDF (4/8 Pages) Micrel Semiconductor – 10 Gigabit Ethernet and SONET, 6 Output, Ultra-Low Jitter LVDS Frequency Synthesizer
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Micrel, Inc.
SM844256
Absolute Maximum Ratings(1)
Supply Voltage (VDDA, VDD, VDDO)................................+4.6V
Input Voltage (VIN)………………………-0.50V to VDD+0.5V
LVDS Output Current (IOUT)………………………… ±10mA
Lead Temperature (soldering, 20sec.)....................... 260°C
Case Temperature ..................................................... 115°C
Storage Temperature (Ts) ..........................-65°C to +150°C
Operating Ratings(2)
Supply Voltage (VDDO) .......................... +2.375V to +3.465V
Supply Voltage (VDD,VDDA).................... +2.375V to +3.465V
Ambient Temperature (TA) .......................... –40°C to +85°C
Junction Thermal Resistance(3)
TSSOP (θJA).......................................................32°C/W
DC Electrical Characteristics(4)
VDDA = VDD = 3.3V ±5% or 2.5V ±5%, VDDO = 2.5V ±5%, TA = –40°C to +85°C, unless noted.
Symbol Parameter
Condition
Min
Typ
Max Units
VDDO
2.5V Operating Voltage
2.375
2.5
2.625
V
VDDA,VDD 3.3V Operating Voltage
2.375
3.3
3.465
V
IDDA
Analog Supply Range
FOUT = 156.25 MHz
55
TBD mA
FOUT = 625.00 MHz
56
IDD
Core Supply Current
FOUT = 156.25 MHz
13
TBD mA
FOUT = 625.00 MHz
13
IDDO
I/O Supply Range
FOUT = 156.25 MHz
195
TBD mA
FOUT = 625.00 MHz
200
VDDA = VDD = VDDO = 3.3V ±5%, TA = –40°C to +85°C, unless noted.
Symbol Parameter
Condition
Min
Typ
Max Units
VDDA,
VDD,
VDDO
3.3V Operating Voltage
3.135
3.3
3.465
V
IDDA
Analog Supply Range
FOUT = 156.25 MHz
55
65
mA
FOUT = 625.00 MHz
56
IDD
Core Supply Current
FOUT = 156.25 MHz
13
17
mA
FOUT = 625.00 MHz
13
IDDO
I/O Supply Range
FOUT = 156.25 MHz
195
234
mA
FOUT = 625.00 MHz
200
Notes:
1. Permanent device damage may occur if absolute maximum ratings are exceeded. This is a stress rating only and functional operation is not implied
at conditions other than those detailed in the operational sections of this data sheet. Exposure to absolute maximum rating conditions for extended
periods may affect device reliability.
2. The data sheet limits are not guaranteed if the device is operated beyond the operating ratings.
3. Package thermal resistance assumes exposed pad is soldered (or equivalent) to the devices most negative potential on the PCB.
4. The circuit is designed to meet the DC specifications shown in the above table after thermal equilibrium has been established.
July 2010
4
M9999-072110-B
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