SM802123 Datasheet, PDF (4/12 Pages) Micrel Semiconductor – ClockWorks™ 125MHz/25MHz Ultra-Low Jitter, LVCMOS Frequency Synthesizer

Micrel, Inc.
Absolute Maximum Ratings⁽¹⁾
Supply Voltage (V_DD, V_DDO1/2) .....................................+4.6V
Input Voltage (V_IN)……….……… ........... –0.5V to V_DD+0.5V
Lead Temperature (soldering, 20s.)........................... 260°C
Case Temperature ..................................................... 115°C
Storage Temperature (T_s) ......................... –65°C to +150°C
SM802123
Operating Ratings⁽²⁾
Supply Voltage (V_DD, V_DDO1/2) ............... +2.375V to +3.465V
Ambient Temperature (T_A) .......................... –40°C to +85°C
Junction Thermal Resistance⁽³⁾
QFN (θ _JA)
Still-Air ............................................................... 24°C/W
QFN (ψ _JB)
Junction-to-Board ................................................ 8°C/W
DC Electrical Characteristics⁽⁴⁾
V_DD = V_DDO1/2 = 3.3V ±5% or 2.5V ±5%
V_DD = 3.3V ±5%, V_DDO1/2 = 3.3V ±5% or 2.5V ±5%
T_A = −40°C to +85°C
Symbol
Parameter
Condition
3.3V Operating Voltage
V_DD, V_DDO1/2
2.5V Operating Voltage
V_DDO1 = V_DDO2
V_DDO1 = V_DDO2
I_DD
Total supply current
Outputs floating
Min.
3.135
2.375
Typ.
3.3
2.5
130
Max.
3.465
2.625
170
Units
V
V
mA
LVCMOS INPUT (OE1, OE2, PLL_BYPASS) DC Electrical Characteristics⁽⁴⁾
V_DD = 3.3V ±5%, or 2.5V ±5%, T_A = −40°C to +85°C
Symbol
Parameter
Condition
Min.
Typ.
V_IH
Input High Voltage
V_IN
Input Low Voltage
2
−0.3
I_IH
Input High Current
V_DD = V_IN = 3.465V
I_IL
Input Low Current
V_DD = 3.465V, V_IN = 0V
−150
Max.
V_DD + 0.3
0.8
150
Units
V
V
μA
μA
LVCMOS OUTPUT DC Electrical Characteristics⁽⁴⁾
V_DD = V_DDO1/2 = 3.3V ±5% or 2.5V ±5%
V_DD = 3.3V ±5%, V_DDO1/2 = 3.3V ±5% or 2.5V ±5%
T_A = −40°C to +85°C. R_L = 50Ω to V_DDO/2
Symbol Parameter
Condition
V_OH
Output High Voltage
Figure 4
V_OL
Output Low Voltage
Figure 4
Min.
V_DDO – 0.7
Typ.
Max.
0.6
Units
V
V
Notes:
1. Permanent device damage may occur if absolute maximum ratings are exceeded. This is a stress rating only and functional operation is not implied
at conditions other than those detailed in the operational sections of this data sheet. Exposure to absolute maximum rating conditions for extended
periods may affect device reliability.
2. The data sheet limits are not guaranteed if the device is operated beyond the operating ratings.
3. Package thermal resistance assumes exposed pad is soldered (or equivalent) to the devices most negative potential on the PCB.
4. The circuit is designed to meet the AC and DC specifications shown in the above table after thermal equilibrium has been established.
January 2012
4
M9999-012312-A
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