SM802109 Datasheet, PDF (4/11 Pages) Micrel Semiconductor – ClockWorks™ PCI-e Quad 100MHz Ultra-Low Jitter, HCSL Frequency Synthesizer

Micrel, Inc.
Absolute Maximum Ratings⁽¹⁾
Supply Voltage (V_DD, V_DDO1/2) ......................................+4.6V
Input Voltage (V_IN) .............................. −0.50V to V_DD + 0.5V
Lead Temperature (soldering, 20s)............................ 260°C
Case Temperature ..................................................... 115°C
Storage Temperature (T_s) ......................... −65°C to +150°C
SM802109
Operating Ratings⁽²⁾
Supply Voltage (V_DD, V_DDO1/2)............... +2.375V to +3.465V
Ambient Temperature (T_A).......................... –40°C to +85°C
Junction Thermal Resistance⁽³⁾
QFN (θ_JA)
Still-Air......................................................... 50°C/W
QFN (ψ_JB)
Junction-to-Board ....................................... 30°C/W
DC Electrical Characteristics⁽⁴⁾
V_DD = V_DDO1/2 = 3.3V ±5% or 2.5V ±5%
V_DD = 3.3V ±5%, V_DDO1/2 = 3.3V ±5% or 2.5V ±5%
T_A = −40°C to +85°C.
Symbol
Parameter
Condition
V_DD, V_DDO1/2 2.5V Operating Voltage
V_DD, V_DDO1/2 3.3V Operating Voltage
I_DD
REF_IN
Supply current V_DD + V_DDO
XTAL_SEL = 0
Outputs 50Ω to V_SS
I_DD
XTAL
Supply current V_DD + V_DDO
XTAL_SEL = 1
Outputs 50Ω to V_SS
Min.
2.375
3.135
Typ.
2.5
3.3
140
Max.
2.625
3.465
Units
V
V
175
mA
150
185
mA
HCSL DC Electrical Characteristics⁽⁴⁾
V_DD = V_DDO1/2 = 3.3V ±5% or 2.5V ±5%
V_DD = 3.3V ±5%, V_DDO1/2 = 3.3V ±5% or 2.5V ±5%
T_A = −40°C to +85°C. R_L = 50Ω to V_SS
Symbol
Parameter
Condition
V_OH
Output High Voltage
V_OL
Output Low Voltage
V_CROSS
Crossing Point Voltage
Min
660
-150
250
Typ.
700
0
350
Max.
850
27
550
Units
mV
mV
mV
Notes:
1. Permanent device damage may occur if absolute maximum ratings are exceeded. This is a stress rating only and functional operation is not implied
at conditions other than those detailed in the operational sections of this data sheet. Exposure to absolute maximum rating conditions for extended
periods may affect device reliability.
2. The data sheet limits are not guaranteed if the device is operated beyond the operating ratings.
3. Package thermal resistance assumes exposed pad is soldered (or equivalent) to the devices most negative potential on the PCB.
4. The circuit is designed to meet the AC and DC specifications shown in the above table(s) after thermal equilibrium has been established.
September 2011
4
M9999-092911-B
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