MIC384 Datasheet, PDF (4/21 Pages) Micrel Semiconductor – Three-Zone Thermal Supervisor Advance Information

MIC384
Micrel
Symbol
Parameter
Serial Data I/O Pin (DATA)
V_OL
Low Output Voltage
Note 6
V_IL
Low Input Voltage
V_IH
High Input Voltage
C_IN
Input Capacitance
I_LEAK
Input current
Serial Clock Input (CLK)
V_IL
Low Input Voltage
V_IH
High Input Voltage
C_IN
Input Capacitance
I_LEAK
Input current
Status Output (/INT)
V_OL
Low Output Voltage,
Note 6
t_INT
Interrupt Propagation Delay,
Note 7, 8
t_nINT
Interrupt Reset Propagation Delay,
Note 7
T_SET0
Default T_SET0 Value
T_HYST0 Default T_HYST0 Value
T_SET1
Default T_SET1 Value
T_HYST1 Default T_HYST1 Value
T_SET2
Default T_SET2 Value
T_HYST2 Default T_HYST2 Value
Serial Interface Timing (Note 7)
t₁
CLK (Clock) Period
t₂
Data In Setup Time to CLK High
t₃
Data Out Stable After CLK Low
t₄
DATA Low Setup Time to CLK Low
t₅
DATA High Hold Time
After CLK High
Condition
Min Typ Max Units
I_OL = 3mA
I_OL = 6mA
2.7V ≤ V_DD ≤ 5.5V
2.7V ≤ V_DD ≤ 5.5V
0.4
V
0.8
V
0.3V_DD V
0.7V_DD
V
10
pF
±0.01 ±1
µA
2.7V ≤ V_DD ≤ 5.5V
2.7V ≤ V_DD ≤ 5.5V
0.3V_DD V
0.7V_DD
V
10
pF
±0.01 ±1
µA
I_OL = 3mA
I_OL = 6mA
from TEMPx > T_SETx or TEMPx < T_HYSTx
to /INT < V_OL, FQ = 00, R_PULLUP = 10kΩ
from any register read to /INT > V_OH,
R_PULLUP = 10kΩ
t_POR after V_DD > V_POR
81
t_POR after V_DD > V_POR
76
t_POR after V_DD > V_POR
97
t_POR after V_DD > V_POR
92
t_POR after V_DD > V_POR
97
t_POR after V_DD > V_POR
92
0.4
V
0.8
V
t_CONV+1 µs
1
µs
81
81
°C
76
76
°C
97
97
°C
92
92
°C
97
97
°C
92
92
°C
start condition
stop condition
2.5
µs
100
ns
0
ns
100
ns
100
ns
Note 1.
Note 2.
Note 3.
Note 4.
Note 5.
Note 6.
Note 7.
Note 8.
Exceeding the absolute maximum rating may damage the device.
The device is not guaranteed to function outside its operating rating.
Devices are ESD sensitive. Handling precautions recommended.
Human body model: 1.5k in series with 100pF. Machine model: 200pF, no series resistance.
Final test on outgoing product is performed at T_A = TBD°C.
T_D is the temperature of the remote diode junction. Testing is performed using a single unit of one of the transistors listed in Table 6.
Current into this pin will result in self-heating of the MIC384. Sink current should be minimized for best accuracy.
Guaranteed by design over the operating temperature range. Not 100% production tested.
t_CONV = t_CONV0 +(2 X t_CONV1). t_CONV0 is the conversion time for the local zone; t_CONV1 is the conversion time for the remote zones.`
MIC384
4
September 2000