SY58606U_09 Datasheet, PDF (3/13 Pages) Micrel Semiconductor – 4.25Gbps Precision, 1:2 CML Fanout Buffer with Internal Termination and Fail Safe Input

Micrel, Inc.
Absolute Maximum Ratings⁽¹⁾
Supply Voltage (V_CC) ............................... –0.5V to +4.0V
Input Voltage (V_IN) .......................................–0.5V to V_CC
CML Output Voltage (V_OUT) .......... V_CC-1.0V to V_CC+0.5V
Current (V_T)
Source or sink on VT pin .............................±100mA
Input Current
Source or sink Current on (IN, /IN) ................±50mA
Current (V_REF)
Source or sink current on V_REF-AC(4) ..............±1.5mA
Maximum operating Junction Temperature .......... 125°C
Lead Temperature (soldering, 20sec.) .................. 260°C
Storage Temperature (T_s) ....................–65°C to +150°C
SY58606U
Operating Ratings⁽²⁾
Supply Voltage (V_IN)........................ +2.375V to +3.60V
Ambient Temperature (T_A) ................... –40°C to +85°C
Package Thermal Resistance⁽³⁾
MLF^®
Still-air (θ_JA) ............................................ 60°C/W
Junction-to-board (ψ_JB) ......................... 33°C/W
DC Electrical Characteristics⁽⁵⁾
T_A = –40°C to +85°C, unless otherwise stated.
Symbol Parameter
Condition
Min
Typ
Max Units
V_CC
Power Supply Voltage Range
2.375
2.5
2.625
V
3.0
3.3
3.6
I_CC
Power Supply Current
No load, max. V_CC
60
77
mA
R_{DIFF_IN}
Differential Input Resistance
(IN-to-/IN)
90
100
110
Ω
V_IH
Input HIGH Voltage
(IN, /IN)
IN, /IN, Note 7
V_CC–1.6
V_CC
V
V_IL
Input LOW Voltage
(IN, /IN)
IN, /IN
0
V_IH–0.1
V
V_IN
Input Voltage Swing
(IN, /IN)
see Figure 3a, Note 6
0.1
1.7
V
V_{DIFF_IN}
Differential Input Voltage Swing see Figure 3b
(|IN - /IN|)
0.2
V
V_{IN_FSI}
Input Voltage Threshold that
Triggers FSI
30
100
mV
V_REF-AC Output Reference Voltage
V_CC–1.3 V_CC–1.2 V_CC–1.1
V
V_{T_IN}
Voltage from Input to V_T
1.28
V
Notes:
1. Permanent device damage may occur if absolute maximum ratings are exceeded. This is a stress rating only and functional operation is not
implied at conditions other than those detailed in the operational sections of this data sheet. Exposure to absolute maximum ratings conditions for
extended periods may affect device reliability.
2. The data sheet limits are not guaranteed if the device is operated beyond the operating ratings.
3. Package thermal resistance assumes exposed pad is soldered (or equivalent) to the device's most negative potential on the PCB. ψ_JB and θ_JA
values are determined for a 4-layer board in still-air number, unless otherwise stated.
4. Due to the limited drive capability, use for input of the same package only.
5. The circuit is designed to meet the DC specifications shown in the above table after thermal equilibrium has been established.
6. V_IN (max) is specified when V_T is floating.
7. V_IH (min) not lower than 1.2V.
August 2009
3
M9999-080509-C
[e-mail] or [phone]