SY58604U_11 Datasheet, PDF (3/13 Pages) Micrel Semiconductor – 3.2Gbps Precision, LVPECL Buffer

Micrel, Inc.
Absolute Maximum Ratings⁽¹⁾
Supply Voltage (V_CC) ............................... –0.5V to +4.0V
Input Voltage (V_IN) ............................. –0.5V to V_CC+0.5V
LVPECL Output Current (I_OUT)
Continuous.......................................................50mA
Surge .............................................................100mA
Current (V_T)
Source or sink on VT pin .............................±100mA
Input Current
Source or sink Current on (IN, /IN) ................±50mA
Current (V_REF)
Source or sink current on V_REF-AC⁽⁴⁾ ............±1.5mA
Maximum Operating Junction Temperature.......... 125°C
Lead Temperature (soldering, 20sec.) .................. 260°C
Storage Temperature (T_s) ....................–65°C to +150°C
SY58604U
Operating Ratings⁽²⁾
Supply Voltage (V_IN)........................ +2.375V to +3.60V
Ambient Temperature (T_A) ................... –40°C to +85°C
Package Thermal Resistance⁽³⁾
DFN
Still-air (θ_JA) ............................................ 93°C/W
Junction-to-board (Ψ_JB).......................... 56°C/W
DC Electrical Characteristics⁽⁵⁾
T_A = –40°C to +85°C, unless otherwise stated.
Symbol Parameter
Condition
Min
Typ
Max Units
V_CC
Power Supply Voltage Range
2.375
2.5
2.625
V
3.0
3.3
3.6
I_CC
R_{DIFF_IN}
Power Supply Current
Differential Input Resistance
(IN-to-/IN)
No load, max. V_CC
30
45
mA
90
100
110
Ω
V_IH
Input HIGH Voltage
(IN, /IN)
IN, /IN, Note 7
V_CC–1.6
V_CC
V
V_IL
Input LOW Voltage
(IN, /IN)
IN, /IN
0
V_IH–0.1
V
V_IN
Input Voltage Swing
(IN, /IN)
see Figure 3a, Note 6
0.1
1.7
V
V_{DIFF_IN}
Differential Input Voltage Swing see Figure 3b
(|IN - /IN|)
0.2
V
V_{IN_FSI}
Input Voltage Threshold that
Triggers FSI
30
100
mV
V_REF-AC Output Reference Voltage
V_CC–1.3 V_CC–1.2 V_CC–1.1
V
V_{T_IN}
Voltage from Input to V_T
1.28
V
Notes:
1. Permanent device damage may occur if absolute maximum ratings are exceeded. This is a stress rating only and functional operation is not
implied at conditions other than those detailed in the operational sections of this data sheet. Exposure to absolute maximum ratings conditions
for extended periods may affect device reliability.
2. The data sheet limits are not guaranteed if the device is operated beyond the operating ratings.
3. Package thermal resistance assumes exposed pad is soldered (or equivalent) to the device's most negative potential on the PCB. Ψ_JB and θ_JA
values are determined for a 4-layer board in still-air number, unless otherwise stated.
4. Due to the limited drive capability, use for input of the same package only.
5. The circuit is designed to meet the DC specifications shown in the above table after thermal equilibrium has been established.
6. V_IN (max) is specified when V_T is floating.
7. V_IH (min) not lower than 1.2V.
September 2011
3
M9999-092911-D
[e-mail] or [phone]