SY58033U Datasheet, PDF (3/8 Pages) Micrel Semiconductor – ULTRA-PRECISION 1:8 FANOUT BUFFER WITH 400mV LVPECL OUTPUTS AND INTERNAL TERMINATION

Micrel, Inc.
Precision Edge^®
SY58033U
Absolute Maximum Ratings⁽¹⁾
Power Supply Voltage (V_CC ) ...................... –0.5V to +4.0V
Input Voltage (V_IN) ......................................... –0.5V to V_CC
Current (V_T)
Source or sink current on V_T pin ........................ ±100mA
Input Current (V_T)
Source or sink current on IN, /IN .......................... ±50mA
Current (V_REF)
Source or sink
current
on
V_REF-AC(3)
.......................
±1.5mA
Lead Temperature Soldering (20 sec.) ..................... 260°C
Storage Temperature Range (T_S ) ........... –65°C to +150°C
Operating Ratings⁽²⁾
Power Supply Voltage (V_CC) ................. +2.375V to +3.60V
Ambient Temperature Range (T_A) ............. –40°C to +85°C
Package Thermal Resistance⁽⁴⁾
MLF^® (θ_JA)
Still-Air ............................................................. 35°C/W
MLF^® (ψ_JB)
Junction-to-Board ............................................ 20°C/W
DC ELECTRICAL CHARACTERISTICS⁽⁵⁾
T_A= –40°C to +85°C.
Symbol
Parameter
Condition
V_CC
Power Supply Voltage
2.5V nominal
3.3V nominal
I_CC
V_IH
V_IL
V_IN
V_{DIFF_IN}
R_IN
V_{T IN}
V_REF-AC
Power Supply Current
Input HIGH Voltage
Input LOW Voltage
Input Voltage Swing
Differential Input Voltage Swing
|IN0, /IN0|, |IN1, /IN1|
In-to-V_T Resistance
Max. In-to-V_T (IN, /IN)
V_CC = max. No. load includes current
through 50Ω pull-ups.
IN, /IN
IN, /IN
IN, /IN, see Figure 1a.
IN, /IN, see Figure 1b.
Min
2.375
3.0
Typ Max Units
2.5 2.625 V
3.3
3.6
V
180 250 mA
V_CC–1.2
0
0.1
0.2
V_CC
V
V_IH–0.1 V
1.7
V
V
40
50
60
Ω
1.28
V
V_CC–1.3 V_CC–1.2 V_CC–1.1 V
LVPECL DC ELECTRICAL CHARACTERISTICS⁽⁵⁾
V_CC = 2.5V ±5% or 3.3V ±10%; R_L = 50Ω to V_CC–2V; T_A= –40°C to +85°C unless otherwise stated
Symbol
Parameter
Condition
Min
Typ
Max Units
V_OH
V_OL
V_OUT
V_{DIFF_OUT}
Output HIGH Voltage
Output LOW Voltage
Output Voltage Swing
Differential Voltage Swing
see Figure 1a.
see Figure 1b.
V_CC–1.145
V_CC–0.895 V
V_CC–1.545
V_CC–1.295 V
150
400
mV
300
800
mV
Notes:
1. Permanent device damage may occur if “Absolute Maximum Ratings” are exceeded. This is a stress rating only and functional operation is not
implied at conditions other than those detailed in the operational sections of this data sheet. Exposure to “Absolute Maximum Ratings” conditions for
extended periods may affect device reliability.
2. The data sheet limits are not guaranteed if the device is operated beyond the operating ratings.
3. Due to the limited drive capability, use for input of the same package only.
4. Thermal performance assumes exposed pad is soldered (or equivalent) to the device’s most negative potential (GND) on the PCB. ψ_JB uses 4-layer
θ_JA in still-air number unless otherwise stated.
5. The circuit is designed to meet the DC specifications shown in the above table after thermal equilibrium has been established.
M9999-020707
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