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MIC2291_11 Datasheet, PDF (3/10 Pages) Micrel Semiconductor – 1.2A PWM Boost Regulator Photo Flash LED Driver
Micrel, Inc.
MIC2291
Absolute Maximum Ratings(1)
Supply Voltage (VIN) .......................................................12V
Switch Voltage (VSW)....................................... –0.3V to 34V
Enable Pin Voltage (VEN)................................... –0.3V to VIN
FB Voltage (VFB)...............................................................6V
Switch Current (ISW) .........................................................2A
Storage Temperature (Ts) .........................–65°C to +150°C
ESD Rating(3).................................................................. 2kV
Operating Ratings(2)
Supply Voltage (VIN).......................................... 2.5V to 10V
Junction Temperature (TJ) ........................ –40°C to +125°C
Package Thermal Resistance
2x2 MLF-8 (θJA) .................................................93°C/W
Thin SOT23-5 (θJA)..........................................256°C/W
Electrical Characteristics(4)
TA = 25°C, VIN = VEN = 3.6V; VOUT = 10V; IOUT = 40mA, bold values indicate –40°C< TJ < +125°C, unless noted.
Symbol Parameter
Condition
Min Typ Max
VIN
Supply Voltage Range
2.5
10
VUVLO
Under Voltage Lockout
1.8
2.1
2.4
IVIN
Quiescent Current
VFB > 200mV, (not switching)
2.8
5
ISD
Shutdown Current
VEN = 0V(5)
0.1
1
VFB
Feedback Voltage
(±5%)
90
95
100
IFB
Feedback Input Current
VFB = 95mV
–450
Line Regulation(7)
3V ≤ VIN ≤ 5V
0.5
1
Load Regulation(7)
5mA ≤ IOUT ≤ 40mA
0.5
DMAX
Maximum Duty Cycle
85
90
ISW
Switch Current Limit
1.2
VSW
Switch Saturation Voltage
ISW = 1.0A
550
ISW
Switch Leakage Current
VEN = 0V, VSW = 10V
0.01
5
VEN
Enable Threshold
TURN ON
TURN OFF
1.5
0.4
IEN
Enable Pin Current
VEN = 10V(6)
20
40
fSW
Oscillator Frequency
1.05 1.2
1.35
VOVP
Overvoltage Protection
MIC2291BML- 15 only
MIC2291BML- 34 only
13
14
16
30
32
34
TJ
Overtemperature
150
Threshold Shutdown
Hysteresis
10
Units
V
V
mA
µA
mV
nA
%
%
%
A
mV
µA
V
V
µA
MHz
V
V
°C
°C
Notes:
1. Absolute maximum ratings indicate limits beyond which damage to the component may occur. Electrical specifications do not apply when operating
the device outside of its operating ratings. The maximum allowable power dissipation is a function of the maximum junction temperature, TJ(max), the
junction-to-ambient thermal resistance, θJA, and the ambient temperature, TA. The maximum allowable power dissipation will result in excessive die
temperature, and the regulator will go into thermal shutdown.
2. The device is not guaranteed to function outside its operating rating.
3. Devices are ESD sensitive. Handling precautions recommended. Human body model.
4. Specification for packaged product only.
5. ISD = IVIN.
6. See “Typical Characteristics” section for other VEN.
7. Guaranteed by design.
May 2007
3
M9999-051507