MIC45212_15 Datasheet, PDF (27/35 Pages) Micrel Semiconductor – 26V/14A DC-to-DC Power Module

Micrel, Inc.
MIC45212
2. Solder Paste Stencil Design (Recommend stencil thickness is 125µm ±25µm)
The solder stencil aperture openings should be smaller than the periphery or large PCB exposed pads to reduce any
chance of build-up of excess solder at the large exposed pad area which can result to solder bridging. The suggested
reduction of the stencil aperture opening is typically 0.20mm smaller than exposed metal trace.
Comment: Cyan colored shaded pad indicates Exposed Trace Keep Out Area.
CRITICAL REQUIREMENT – Do not duplicate land pattern for exposed metal trace as solder stencil opening because the
design and dimension values are different.
3. Stacked-up of Pad Layout and Solder Paste Stencil
March 5, 2015
27
Revision 1.1