MIC45208-1 Datasheet, PDF (27/35 Pages) Micrel Semiconductor – 26V 10A DC-to-DC Power Module

Micrel, Inc.
MIC45208
Solder Paste Stencil Design (Recommend stencil
thickness is 125 ±25µm)
The solder stencil aperture openings should be smaller
than the periphery or large PCB exposed pads to reduce
any chance of build-up of excess solder at the large
exposed pad area which can result to solder bridging. The
suggested reduction of the stencil aperture opening is
typically 0.20mm smaller than exposed metal trace.
The suggested reduction of the stencil aperture opening is
typically 0.20mm smaller than exposed metal trace.
Note: A critical requirement is to not duplicate land pattern
of the exposed metal trace as solder stencil opening as the
design and dimension values are different.
Note:
Cyan-colored shaded pad indicate exposed trace keep out area.
Figure 18. Solder Stencil Opening
February 6, 2015
Figure 19. Stack-Up of Pad Layout and Solder Paste Stencil
27
Revision 2.0