English
Language : 

VMD-1Q-2.0G Datasheet, PDF (1/5 Pages) Merrimac Industries, Inc. – VECTOR MODULATOR
VMD-1Q-2.0G (2.14 GHz)
VECTOR MODULATOR
REV: 004, 09/21/01
• 2.04 - 2.24 GHz
• 30 dB ATTENUATION RANGE
• 360 DEGREE PHASE RANGE
• SURFACE MOUNT
• TAPE & REEL
TECHNICAL DESCRIPTION / APPLICATION
MULTI-MIX® Q-SERIES VECTOR MODULATORS
The Multi-Mix® VMD-Q series provides a vector modulator with variable IQ control of phase and ampli-
tude in a surface mount outline. Accurate phase and amplitude control through a 360 degree range
make them ideal for feed forward and signal processing applications.
VMD-Q vector modulators are fusion bonded multilayer stripline assemblies. The fusion bonding
process yields a homogeneous monolithic dielectric structure with reliability, ruggedness, and electrical
performance that is superior to conventional adhesive bonding techniques.
The VMD-Q series is an easy to install SMD designed specifically for the full spectrum of wireless appli-
cations. The high stability ceramic filled PTFE dielectrics utilized in these components are compatible
with common substrates such as FR-4, G-10, and polyamide. The wrap around ground plane provides
excellent EM shielding.
Additional benefits include:
• Available on tape and reel
• Cost effective for commercial wireless applications
• Surface mount outline
• Operating temperature range –55°C to +85°C.
• Can be integrated with other Multi-Mix® components in a multi-function module
AVAILABLE ON
TAPE & REEL
RELIABILITY
The product family has passed environmental screening including Thermal shock, Burn-in, Acceleration,
Vibration, Mechanical Shock, Moisture Resistance, Resistance to Solder Heat, and Thermal Cycling Life
Test (>1000 cycles).
THE MULTI-MIX® PROCESS
Multi-Mix® is a manufacturing process based on fluoropolymer composite substrates that are fusion
bonded together into a multilayer structure. The fusion bonding process yields a homogeneous mono-
lithic structure with superior performance at microwave and millimeter wave frequencies. The bonded
layers can contain embedded semiconductors, MMICs, etched resistors, circuit patterns, and plated-
through vias to form a SMD module that requires no additional packaging and is suitable for automated
assembly.
THE MULTI-MIX MICROTECHNOLOGY® GROUP IS ISO-9001 REGISTERED
Merrimac Industries / 41 Fairfield Place, West Caldwell, NJ 07006
Tel: 1.888.434.MMFM / Fax: 973.882.5990 / Email: MMFM@merrimacind.com / www.Multi-Mix.com