QHD-3C-3.4G Datasheet, PDF (1/5 Pages) Merrimac Industries, Inc. – QUADRATURE HYBRID

QHD-3C-3.4G
QUADRATURE HYBRID
PRELIMINARY REV: 001, 06/04/03
• 1.75 - 5.0 GHz
• LOWEST LOSS
• HIGHEST ISOLATION
• BEST PHASE/AMPLITUDE BALANCE
• TAPE & REEL
TECHNICAL DESCRIPTION / APPLICATION
MULTI-MIX® QUAD HYBRIDS
The Multi-Mix® QHD series provides a 3 dB coupler with low insertion loss, low VSWR, and high isola-
tion. Accurate phase and amplitude balance make them ideal for applications involving IQ networks,
power amplifiers, signal distribution and processing.
QHD quad hybrids are fusion bonded multilayer stripline assemblies. The fusion bonding process yields
a homogeneous monolithic dielectric structure with reliability, ruggedness, and electrical performance
that is superior to conventional adhesive bonding techniques.
The QHD series is an easy to install SMD designed specifically for the full spectrum of wireless applica-
tions. The high stability ceramic filled PTFE dielectrics utilized in these components are compatible with
common substrates such as FR-4, G-10, and polyamide. The wrap around ground plane provides
excellent EM shielding.
Additional benefits include:
Available on tape and reel
Cost effective for commercial wireless applications
Industry standard size
Temperature stable from –65° to +125° C.
Can be integrated with other Multi-Mix® components in a multi-function module
AVAILABLE ON
TAPE & REEL
RELIABILITY
All QHD series components are 100% tested. The product family has passed environmental screening
per MIL-TSD-202 including Thermal shock, Burn-in, Acceleration, Vibration, Mechanical Shock, Moisture
Resistance, Resistance to Solder Heat, and Thermal Cycling Life Test (1000 cycles).
THE MULTI-MIX® PROCESS
Multi-Mix® is a manufacturing process based on fluoropolymer composite substrates that are fusion
bonded together into a multilayer structure. The fusion bonding process yields a homogeneous mono-
lithic structure with superior performance at microwave and millimeter wave frequencies. The bonded
layers can contain embedded semiconductors, MMICs, etched resistors, circuit patterns, and plated-
through vias to form a SMD module that requires no additional packaging and is ready for pick and
place.
THE MULTI-MIX MICROTECHNOLOGY^® GROUP IS ISO-9001 REGISTERED
U.S. patent 6,099,677 and other patents pending.
Merrimac Industries / 41 Fairfield Place, West Caldwell, NJ 07006
Tel: [phone].MMFM / Fax: [phone] / Email: [e-mail] / www.Multi-Mix.com