PDD-3Z-2.45G Datasheet, PDF (1/5 Pages) Merrimac Industries, Inc. – 3-WAY POWER DIVIDERS

PDD-3Z-2.45G
3-WAY POWER DIVIDERS
REV: 001, 05/20/02
• 2.35 - 2.60 GHz
• LOW LOSS
• HIGH ISOLATION
• SURFACE MOUNT
• TAPE & REEL
TECHNICAL DESCRIPTION / APPLICATION
MULTI-MIX PICO™ Z-SERIES POWER DIVIDERS
The Multi-Mix® PDD-Z series provides an in-phase, binary power divider with low insertion loss in a
small outline. Accurate phase and amplitude balance make them ideal for applications involving IQ net-
works, power amplifiers, signal distribution and processing.
PDD-Z power dividers are fusion bonded multilayer stripline assemblies. The fusion bonding process
yields a homogeneous monolithic dielectric structure with reliability, ruggedness, and electrical perform-
ance that is superior to conventional adhesive bonding techniques.
The PDD-Z series is an easy to install SMD designed specifically for the full spectrum of wireless appli-
cations. The high stability ceramic filled PTFE dielectrics utilized in these components are compatible
with common substrates such as FR-4, G-10, and polyamide. The wrap around ground plane provides
excellent EM shielding.
Additional benefits include:
Available on tape and reel
Cost effective for commercial wireless applications
Small outline size
Operating temperature range –55°C to +85°C.
Can be integrated with other Multi-Mix® components in a multi-function module
AVAILABLE ON
TAPE & REEL
RELIABILITY
The product family has passed environmental screening including Thermal shock, Burn-in, Acceleration,
Vibration, Mechanical Shock, Moisture Resistance, Resistance to Solder Heat, and Thermal Cycling Life
Test (>1000 cycles).
THE MULTI-MIX® PROCESS
Multi-Mix® is a manufacturing process based on fluoropolymer composite substrates that are fusion
bonded together into a multilayer structure. The fusion bonding process yields a homogeneous mono-
lithic structure with superior performance at microwave and millimeter wave frequencies. The bonded
layers can contain embedded semiconductors, MMICs, etched resistors, circuit patterns, and plated-
through vias to form a SMD module that requires no additional packaging and is suitable for automated
assembly.
THE MULTI-MIX MICROTECHNOLOGY^® GROUP IS ISO-9001 REGISTERED
Merrimac Industries / 41 Fairfield Place, West Caldwell, NJ 07006
Tel: [phone] / Fax: [phone] / Email: [e-mail] / www.Multi-Mix.com