ILC-3F-2.14G Datasheet, PDF (1/5 Pages) Merrimac Industries, Inc. – IN-LINE COUPLERS

ILC-3F-2.14G
IN-LINE COUPLERS
REV: 002, 06/28/02
• 2.04 - 2.24 GHz
• LOW LOSS
• LOW VSWR
• HIGH ISOLATION
• SURFACE MOUNT
TECHNICAL DESCRIPTION / APPLICATION
MULTI-MIX^® F SERIES IN-LINE COUPLERS
The Multi-Mix^® ILC-F series provides a power divider and combiner function with low insertion loss,
high isolation, and high power handling in a small outline. The ILC series are composed of serial con-
nected multi-couplers with each coupler having a different nominal coupling value. Equal split loss is
maintained at all of the coupled ports, since the direct-path loss of previous couplers is added. Each of
the paths through a divider / combiner pair have equal insertion phase, but the individual port paths do
not. Accurate phase and amplitude balance make them ideal for applications involving power
amplifiers, signal distribution and processing.
ILC-F in-line couplers are fusion bonded multilayer stripline assemblies. The fusion bonding process
yields a homogeneous monolithic dielectric structure with reliability, ruggedness, and electrical
performance that is superior to conventional adhesive bonding techniques.
The ILC-F series is an easy to install SMD designed specifically for the full spectrum of wireless
applications. The high stability ceramic filled PTFE dielectrics utilized in these components are
compatible with common substrates such as FR-4, G-10, and polyamide. The wrap around ground
plane provides excellent EM shielding.
Additional benefits include:
• Cost effective for commercial wireless applications
• Operating temperature range –55°C to +85°C.
• Can be integrated with other Multi-Mix^® components in a multi-function module
AVAILABLE ON
TAPE & REEL
RELIABILITY
The product family has passed environmental screening including Thermal shock, Burn-in,
Acceleration, Vibration, Mechanical Shock, Moisture Resistance, Resistance to Solder Heat, and
Thermal Cycling Life Test (>1000 cycles).
THE MULTI-MIX^® PROCESS
Multi-Mix^® is a manufacturing process based on fluoropolymer composite substrates that are fusion
bonded together into a multilayer structure. The fusion bonding process yields a homogeneous
monolithic structure with superior performance at microwave and millimeter wave frequencies. The
bonded layers can contain embedded semiconductors, MMICs, etched resistors, circuit patterns, and
plated-through vias to form a SMD module that requires no additional packaging and is suitable for
automated assembly.
THE MULTI-MIX MICROTECHNOLOGY^® GROUP IS ISO-9001 REGISTERED
U.S. patent 6,099,677 and other patents pending.
Merrimac Industries / 41 Fairfield Place, West Caldwell, NJ 07006
Tel: [phone].MMFM / Fax: [phone] / Email: [e-mail] / www.Multi-Mix.com