HJD-2Z-1.9G Datasheet, PDF (1/5 Pages) Merrimac Industries, Inc. – HYBRID JUNCTION

HJD-2Z-1.9G
HYBRID JUNCTION
REV: 004, 01/09/03
• 1.8 - 1.99 GHz
• HIGH POWER…100 WATTS CW
• LOWEST LOSS
• HIGHEST ISOLATION
• BEST PHASE/AMPLITUDE BALANCE
• SURFACE MOUNT
• TAPE & REEL
TECHNICAL DESCRIPTION / APPLICATION
MULTI-MIX PICO™ Z-SERIES HYBRID JUNCTION
The Multi-Mix® HJD-Z series provides a 3 dB, hybrid junction with low insertion loss, high isolation, and
high power handling in a small outline. Accurate phase and amplitude balance, make them ideal for use
in PCS power amplifiers, beamforming networks, matching baluns, signal distribution and processing
functions. They can also be used in monopulse receivers for processing signal feeds off the antenna.
Hybrid junctions are often used as part of more complex divider/coupler, balance mixers, image reject
mixers, single sideband modulators and antenna feed network assemblies.
HJD-Z hybrid junctions are fusion bonded multilayer stripline assemblies. The fusion bonding process
yields a homogeneous monolithic dielectric structure with reliability, ruggedness, and electrical
performance that is superior to conventional adhesive bonding techniques.
The HJD-Z series is an easy to install SMD designed specifically for the full spectrum of wireless
applications. The high stability ceramic filled PTFE dielectrics utilized in these components are
compatible with common substrates such as FR-4, G-10, and polyamide. The wrap around ground
plane provides excellent EM shielding.
Additional benefits include:
AVAILABLE ON
TAPE & REEL
• Small outline size
• High power…100 Watts CW
• Cost effective for commercial wireless applications
• Operating temperature range –55°C to +85°C.
• Available on tape and reel
• Can be integrated with other Multi-Mix® components in a multi-function module
RELIABILITY
The product family has passed environmental screening including Thermal shock, Burn-in, Acceleration,
Vibration, Mechanical Shock, Moisture Resistance, Resistance to Solder Heat, and Thermal Cycling Life
Test (>1000 cycles).
THE MULTI-MIX® PROCESS
Multi-Mix® is a manufacturing process based on fluoropolymer composite substrates that are fusion
bonded together into a multilayer structure. The fusion bonding process yields a homogeneous mono-
lithic structure with superior performance at microwave and millimeter wave frequencies. The bonded
layers can contain embedded semiconductors, MMICs, etched resistors, circuit patterns, and plated-
through vias to form a SMD module that requires no additional packaging and is suitable for automated
assembly.
THE MULTI-MIX MICROTECHNOLOGY^® GROUP IS ISO-9001 REGISTERED
Merrimac Industries / 41 Fairfield Place, West Caldwell, NJ 07006
Tel: [phone].MMFM / Fax: [phone] / Email: [e-mail] / www.Multi-Mix.com