DLL-113R-0.88G Datasheet, PDF (1/1 Pages) Merrimac Industries, Inc. – DELAY LINE

DLL-113R-0.88G
DELAY LINE
PRELIMINARY REV: 006, 12/02/04
FEATURES
• 869 - 894 MHz
• LOW LOSS
• LOW VSWR
• SURFACE MOUNT
• LOW COST
TECHNICAL DESCRIPTION
MULTI-MIX^® DELAY LINES
APPLICATIONS
• AMPS
• BASE STATION POWER AMPLIFIER
LINEARIZATION NETWORKS
• FEED FORWARD
• PRE-DISTORTION
• ADAPTIVE INTERFERENCE CANCELLATION
The DLL-113R-0.88G, a member of the Multi-Mix^® DLL family of delay lines, provides a mean delay of
11.25 nS in the AMPS band and features low insertion loss and low VSWR. The DLL-113R-0.88G exhibits
excellent phase linearity and amplitude flatness over the 869 - 894 MHz frequency range. The Multi-Mix^®
DLL-113R-0.88G is intended for use in power amplifier linearization networks such as feedforward and
predistortion.
DLL delay lines are fusion bonded multilayer stripline structures. The DLL series offers an excellent alter-
native to expensive coaxial and delay filter structures. The fusion bonding process yields a homgeneous
monolithic dielectric structure with reliability, ruggedness and electrical and thermal performance that is
superior to conventional adhesive bonding techniques.
FREQUENCY RANGE
MHz
GENERAL SPECIFICATIONS
MEAN DELAY*
(nS)
PHASE DEVIATION
(DEGREES MAX)
AMPLITUDE FLATNESS
(dB p-p)
869 - 894
11.25 ± 0.2
± 0.5
0.15
RETURN LOSS
(dB MIN)
INSERTION LOSS
(dB MIN)
POWER HANDLING
(WATTS)
RF INTERFACE
SIZE/OUTLINE
(Inches - l,w,h)
20
4.6
15
Surface Mount
1.0 x 1.0 x 0.18
Specifications are based upon unit mounted on printed circuit board with 50 Ohm nominal impedance.
*Mean delay refers to the group delay of the applied input signal through the network. The specified tolerance relates to unit-unit group delay variation.
PACKAGE OUTLINE / MOUNTING CONFIGURATION
HOT VIA
1.000 [25.40]
HOT VIA
HOT VIA
0.109 [2.76]
2X 0.057 [1.45]
2X 0.389 [9.87]
3X HOT VIA
1
ORIENTATION MARKER
DENOTES PIN LOCATION
2
GND
PIN 2
0.168 [4.28]
5X 0.037 [0.94]
0.848 [21.54]
2XRR0.00.50757[R[1R.415.4] _5]
GND
PIN 1
GROUND PLANE OF UNIT SHOULD
BE SOLDERED TO GROUND PLANE
OF CIRCUIT BOARD FOR OPTIMUM
PERFORMANCE.
0.400 [10.16]
0.021 [0.52]
2X 0.889 [22.58]
0.089 [2.26] _{2RX0.R0405.0[5R51[.R141.]40]}
2X 0.076 [1.93] SQ
GROUND PLANE
0.848 [21.54]
50 OHM LINE
.032 DIELECTRIC THICKNESS
ER = 3.38
2X 0.037 [0.94]
THE MULTI-MIX MICROTECHNOLOGY^® GROUP IS ISO 9001:2000 REGISTERED
U.S. Patent 6,099,677 and other Patents Pending.
Merrimac Industries / 41 Fairfield Place, West Caldwell, NJ 07006
Tel: [phone].MMFM / Fax: [phone] / Email: [e-mail] / www.Multi-Mix.com