CSD-20H-1.9G Datasheet, PDF (1/5 Pages) Merrimac Industries, Inc. – DIRECTIONAL COUPLERS

• 1.7 - 2.0 GHz
• LOWEST LOSS
• HIGHEST ISOLATION
• BEST PHASE/AMPLITUDE BALANCE
• SURFACE MOUNT
• TAPE & REEL
CSD-20H-1.9G
DIRECTIONAL COUPLERS
REV: 003, 02/13/03
TECHNICAL DESCRIPTION / APPLICATION
MULTI-MIX^® DIRECTIONAL COUPLERS
The Multi-Mix^® CSD series provides directional couplers with low insertion loss, low VSWR, and high directivity.
Precise coupling and frequency sensitivity make them ideal for applications power amplifiers, signal
distribution and processing.
CSD directional couplers are fusion bonded multilayer stripline assemblies. The fusion bonding process
yields a homogeneous monolithic dielectric structure with reliability, ruggedness, and electrical performance
that is superior to conventional adhesive bonding techniques.
The CSD series is an easy to install SMD designed specifically for the full spectrum of wireless applications.
The high stability ceramic filled PTFE dielectrics utilized in these components are compatible with common
substrates such as FR-4, G-10, and polyamide. The wrap around ground plane provides excellent EM
shielding.
Additional benefits include:
• Available on tape and reel.
• Cost effective for commercial wireless applications.
• Industry standard size.
• Temperature stable from –65 to +125 degrees C.
• Can be integrated with other Multi-Mix^® components in a multi-function module.
AVAILABLE ON
TAPE & REEL
RELIABILITY
All CSD series components are 100% tested. The product family has passed environmental screening per
MIL-STD-202 including Thermal shock, Burn-in, Acceleration, Vibration, Mechanical Shock, Moisture
Resistance, Resistance to Solder Heat, and Thermal Cycling Life Test (1000 cycles).
THE MULTI-MIX^® PROCESS
Multi-Mix^® is a manufacturing process based on fluoropolymer composite substrates that are fusion bonded
together into a multilayer structure. The fusion bonding process yields a homogeneous monolithic structure
with superior performance at microwave and millimeter wave frequencies. The bonded multilayers can
contain embedded semiconductors, MMICs, etched resistors, circuit patterns, and plated-through vias to
form a SMD module that requires no additional packaging and is ready for pick and place.
THE MULTI-MIX MICROTECHNOLOGY^® GROUP IS ISO-9001 REGISTERED
Merrimac Industries, Inc. / 41 Fairfield Place, West Caldwell, NJ 07006
Tel: [phone].MMFM / Fax: [phone] / Email: [e-mail] / www.Multi-Mix.com