CSD-20H-0.9G Datasheet, PDF (1/5 Pages) Merrimac Industries, Inc. – DIRECTIONAL COUPLER

CSD-20H-0.9G
DIRECTIONAL COUPLER
REV: 002, 02/13/03
• 0.8 - 1.0 GHz
• LOWEST LOSS
• HIGHEST ISOLATION
• BEST PHASE/AMPLITUDE BALANCE
• SURFACE MOUNT
• TAPE & REEL
TECHNICAL DESCRIPTION / APPLICATION
MULTI-MIX^® DIRECTIONAL COUPLERS
The Multi-Mix^® CSD series provides directional couplers with low insertion loss, low VSWR, and high
directivity. Precise coupling and frequency sensitivity make them ideal for applications power ampli-
fiers, signal distribution and processing.
CSD directional couplers are fusion bonded multilayer stripline assemblies. The fusion bonding process
yields a homogeneous monolithic dielectric structure with reliability, ruggedness, and electrical perform-
ance that is superior to conventional adhesive bonding techniques.
The CSD series is an easy to install SMD designed specifically for the full spectrum of wireless applica-
tions. The high stability ceramic filled PTFE dielectrics utilized in these components are compatible with
common substrates such as FR-4, G-10, and polyamide. The wrap around ground plane provides
excellent EM shielding.
Additional benefits include:
AVAILABLE ON
TAPE & REEL
• Available on tape and reel
• Cost effective for commercial wireless applications
• Industry standard size
• Temperature stable from –65 to +125 degrees C.
• Can be integrated with other Multi-Mix^® components in a multi-function module
RELIABILITY
All CSD series components are 100% tested. The product family has passed environmental screening
per MIL-STD-202 including Thermal shock, Burn-in, Acceleration, Vibration, Mechanical Shock, Moisture
Resistance, Resistance to Solder Heat, and Thermal Cycling Life Test (1000 cycles).
THE MULTI-MIX^® PROCESS
Multi-Mix^® is a manufacturing process based on fluoropolymer composite substrates that are fusion
bonded together into a multilayer structure. The fusion bonding process yields a homogeneous mono-
lithic structure with superior performance at microwave and millimeter wave frequencies. The bonded
multilayers can contain embedded semiconductors, MMICs, etched resistors, circuit patterns, and plat-
ed-through vias to form a SMD module that requires no additional packaging and is ready for pick and
place.
THE MULTI-MIX MICROTECHNOLOGY^® GROUP IS ISO-9001 REGISTERED
Merrimac Industries / 41 Fairfield Place, West Caldwell, NJ 07006
Tel: [phone].MMFM / Fax: [phone] / Email: [e-mail] / www.Multi-Mix.com