CSD-10Z-3.5G Datasheet, PDF (1/5 Pages) Merrimac Industries, Inc. – DIRECTIONAL COUPLERS

CSD-10Z-3.5G
DIRECTIONAL COUPLERS
REV: 001, 06/20/02
• 3.3 - 3.7 GHz
• HIGH POWER…100 WATTS CW
• LOW LOSS
• LOW VSWR
• SURFACE MOUNT
• TAPE & REEL
TECHNICAL DESCRIPTION / APPLICATION
MULTI-MIX PICO™ Z-SERIES DIRECTIONAL COUPLERS
The Multi-Mix^® CSD-Z series provides directional couplers with low insertion loss, low VSWR, and high
power handling in a small outline. Precise coupling and frequency sensitivity make them ideal for
applications involving power amplifiers, signal distribution and processing.
CSD-Z directional couplers are fusion bonded multilayer stripline assemblies. The fusion bonding
process yields a homogeneous monolithic dielectric structure with reliability, ruggedness, and electrical
performance that is superior to conventional adhesive bonding techniques.
The CSD-Z series is an easy to install SMD designed specifically for the full spectrum of wireless
applications. The high stability ceramic filled PTFE dielectrics utilized in these components are
compatible with common substrates such as FR-4, G-10, and polyamide. The wrap around ground
plane provides excellent EM shielding.
Additional benefits include:
AVAILABLE ON
TAPE & REEL
• Small outline size
• High power…100 Watts CW
• Cost effective for commercial wireless applications
• Operating temperature range –55°C to +85°C.
• Available on tape and reel
• Can be integrated with other Multi-Mix^® components in a multi-function module
RELIABILITY
The product family has passed environmental screening including Thermal shock, Burn-in, Acceleration,
Vibration, Mechanical Shock, Moisture Resistance, Resistance to Solder Heat, and Thermal Cycling Life
Test (>1000 cycles).
THE MULTI-MIX^® PROCESS
Multi-Mix^® is a manufacturing process based on fluoropolymer composite substrates that are fusion
bonded together into a multilayer structure. The fusion bonding process yields a homogeneous
monolithic structure with superior performance at microwave and millimeter wave frequencies. The
bonded multilayers can contain embedded semiconductors, MMICs, etched resistors, circuit patterns,
and plated-through vias to form a SMD module that requires no additional packaging and is suitable for
automated assembly.
THE MULTI-MIX MICROTECHNOLOGY^® GROUP IS ISO-9001 REGISTERED
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Merrimac Industries / 41 Fairfield Place, West Caldwell, NJ 07006
Tel: [phone].MMFM / Fax: [phone] / Email: [e-mail] / www.Multi-Mix.com