1-5SMC Datasheet, PDF (1/4 Pages) MERITEK ELECTRONICS CORPORATION – For surface mounted applications in order to optimize board space

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1560& Series
MERITEK
FEATURES
For surface mounted applications in order to optimize board space.
Low profile package.
Built-in strain relief.
Glass passivated junction.
Low inductance.
Excellent clamping capability.
Repetition Rate (duty cycle): 0.01%.
Fast response time: typically less than 1.0ps from 0 volt to BV min.
Typical IR less than 1µA above 10V.
High Temperature soldering: 260°C/10 seconds at terminals.
UL E2230
SMC/DO-214AB
M_MECHANICAL DATA
Case: JEDEC DO-214AB. Molded plastic over glass passivated junction.
Terminal: Solder plated, solderable per MIL-STD-750, Method 2026.
Polarity: Color band denotes cathode except Bidirectional.
Standard Packaging: 16mm tape (EIA STD RS-481).
Weight: 0.007 ounce, 0.21 grams.
D_DEVICES FOR BIPOLAR APPLICATION
For Bidirectional use CA suffix for type 1.5SMC6.8CA through type 1.5SMC550CA; Electrical characteristics
apply in both directions.
MMAXIMUM RATINGS AND CHARACTERISTICS
R ^{Ratings at 25°C ambient temperature unless otherwise specified.}
RATING
SYMBOL
VALUE
Peak Pulse Power Dissipation on 10/1000 s waveform.
(Note 1, Note 2, Fig. 1)
Peak Pulse Current on 10/1000 s waveform. (Note 1, Fig. 3)
Steady State Power Dissipation at T_L =75 ƒ&, Lead length .375”
(9.5mm). (Note 2, Fig. 5)
Peak Forward Surge Current,8.3ms Single Half Sine-Wave
Superimposed on Rated Load. (JEDEC Method) (Note 3, Fig. 6)
Operating junction and Storage Temperature Range.
P_PPM
I_PPM
P_M(AV)
I_FSM
T_J , T_STG
Minimum 1,500
See Table
6.5
200
-65 to +150
Notes: 1. Non-repetitive current pulse, per Fig. 3 and derated above TA = 25ƒ& per Fig. 2.
2. Mounted on 8.0mm x 8.0mm Copper Pads to each terminal.
3. 8.3ms single half sine-wave, or equivalent square wave, Duty cycle = 4 pulses per minute maximum.
UNIT
Watts
Amps
Watts
Amps
ƒ&
All specifications DUHsubject to change without notice.
1
Rev 7