MLX81150 Datasheet, PDF (20/23 Pages) Melexis Microelectronic Systems – LIN-Slave for relay and DC motor control

MLX81150
LIN-Slave for relay and DC motor control
5.2 Package data TQFPeP 48L (7x7, 48 leads)
A A1 A2 b b1 D D1 D2 E E1 E2 e L N ccc ddd
Min - 0.05 0.95 0.17 0.17 9.00 7.00 4.00 9.00 7.00 4.00 0.50 0.45 48 -
-
Nom -
- 1.00 0.22 0.20
0.60
-
-
Max 1.20 0.15 1.05 0.27 0.23
0.75
0.08 0.08
Table 6: Mechanical Dimensions TQFPeP(48) 7x7
Notes:
1. All Dimensioning and Tolerances conform to ASME Y14.5M-1994,
∆2. Datum Plane [-|-|-] located at Mould Parting Line and coincident with Lead, where Lead exists, plastic body at bottom of parting line.
∆3. Datum [A-B] and [-D-] to be determined at centreline between leads where leads exist, plastic body at datum plane [-|-|-]
∆4. To be determined at seating plane [-C-]
∆5. Dimensions D1 and E1 do not include Mould protrusion. Dimensions D1 and E1 do not include mould protrusion. Allowable mould protrusion is 0.254 mm on D1 and E1 dimensions.
6. 'N' is the total number of terminals
∆7. These dimensions to be determined at datum plane [-|-|-]
8. Package top dimensions are smaller than bottom dimensions and top of package will not overhang bottom of package.
∆9. Dimension b does not include dam bar protrusion, allowable dam bar protrusion shall be 0.08mm total in excess of the "b" dimension at maximum material condition, dam bar can not be
located on the lower radius of the foot.
10. Controlling dimension millimeter.
11. maximum allowable die thickness to be assembled in this package family is 0.38mm
12. This outline conforms to JEDEC publication 95 Registration MS-026, Variation ABA, ABC & ABD.
∆13. A1 is defined as the distance from the seating plane to the lowest point of the package body.
∆14. Dimension D2 and E2 represent the size of the exposed pad. The actual dimensions are specified ion the bonding diagram, and are independent from die size.
15. Exposed pad shall be coplanar with bottom of package within 0.05.
Exposed pad need best
possible contact to ground for
exlectrical and thermal reasons
Figure 13: Package data TQFPeP48
MLX81150 – Product abstract
Page 20 of 23
TFR / 02.08.2013
Rev 015