S8A_08 Datasheet, PDF (2/4 Pages) Micro Commercial Components – 8 Amp Silicon Rectifier 50 to 1000 Volts

MCC
TM
Micro Commercial Components

  omponents
20736 Marilla Street Chatsworth

  !"#
$ %    !"#
Features
• Lead Free Finish/Rohs Compliant (Note1) ("P"Suffix designates
Compliant. See ordering information)
• Low Thermal Resistance
• High Current Capability
• High Temp Soldering: 260°C for 10 Seconds At Terminals
x Case Material: Molded Plastic. UL Flammability
Classification Rating 94V-0 and MSL rating 1
Maximum Ratings
• Operating Temperature: -55°C to +150°C
• Storage Temperature: -55°C to +150°C
• Maximum Thermal Resistance; 8°C/W Junction To Lead
Microsemi
Part
Device
Number Marking
S8A
S8B
S8D
S8G
S8J
S8K
S8M
S8A
S8B
S8D
S8G
S8J
S8K
S8M
Maximum
Recurrent
Peak Reverse
Voltage
50V
100V
200V
400V
600V
800V
1000V
Maximum
RMS
Voltage
35V
70V
140V
280V
420V
560V
700V
Maximum
DC
Blocking
Voltage
50V
100V
200V
400V
600V
800V
1000V
Electrical Characteristics @ 25°C Unless Otherwise Specified
Average Forward
Current
I_F(AV)
8.0A T_a = 75°C
Peak Forward Surge
I_FSM
Current
300A 8.3ms, half sine
Maximum
Instantaneous
Forward Voltage
Maximum DC
Reverse Current At
Rated DC Blocking
Voltage
V_F
1.20V I_FM = 8.0A;
T_J = 25°C*
I_R
10µA T_J = 25°C
100µA T_J = 100°C
Typical Junction
C_J
150pF Measured at
Capacitance
1.0MHz, V_R=4.0V
*Pulse test: Pulse width 200 µsec, Duty cycle 2%
Note: 1. High Temperature Solder Exemptions Applied, see EU Directive Annex 7.
S8A
THRU
S8M
8 Amp
Silicon Rectifier
50 to 1000 Volts
DO-214AB
(HSMC) (Round Lead)
H
Cathode Band
J
A
C
E
D
F
G
INCHES
DIM
MIN
A
.200
B
.177
C
.002
D
---
E
.047
F
.168
G
.309
H
.239
J
.234
DIMENSIONS
MAX
.214
.203
.005
.02
.056
.179
.322
.243
.240
MM
MIN
5.08
4.70
.05
---
1.20
4.27
7.85
6.08
5.95
B
MAX
5.43
5.30
.13
.51
1.42
4.55
8.18
6.18
6.10
NOTE
SUGGESTED SOLDER
PAD LAYOUT
0.190
0.200
0.070”
Revision: 5
www.mccsemi.com
1 of 3
2008/02/01