SMCJ50 Datasheet, PDF (1/8 Pages) Fairchild Semiconductor – DEVICES FOR BIPOLAR APPLICATIONS

MCC
Features

  omponents
21201 Itasca Street Chatsworth

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l For surface mount application in order to optimize board space
l Low inductance
l Low profile package
l Built-in strain relief
l Glass passivated junction
l Excellent clamping capability
l Repetition Rate( duty cycle): 0.05%
l Fast response time: typical less than 1ps from 0V to BV min
l Typical I_D less than 1uA above 10V
l High temperature soldering: 260^oC/10 seconds at terminals
l Plastic package has Underwrites Laboratory Flammability
Classification 94V-O
SMCJ5.0
THRU
SMCJ170CA
Transient
Voltage Suppressor
5.0 to 170 Volts
1500 Watt
DO-214AB
(SMCJ) (LEAD FRAME)
G
H
Mechanical Data
D
l CASE: JEDEC DO-214AB molded plastic body over
A
C
passivated junction
l Terminals: solderable per MIL-STD-750, Method 2026
l Polarity: Color band denotes positive end( cathode) except
Bi-directional types.
l Standard packaging: 16mm tape per ( EIA 481).
l Weight: 0.007 ounce, 0.21 gram
Maximum Ratings @ 25^oC Unless Otherwise Specified
E
F
DIMENSIONS
INCHES
DIM
MIN
MAX
A
.079
.103
B
.108
.128
C
.002
.008
D
.006
.012
E
.030
.050
F
..305
.320
G
.260
.280
H
.220
.245
MM
MIN
2.00
2.75
0.051
0.152
0.76
7.75
6.60
5.59
B
MAX
2.62
3.25
0.203
0.305
1.27
8.13
7.11
6.22
NOTE
Peak Pulse Current on I_PPM See Table 1 Amps
10/1000us
waveform(Note1, Fig3)
SUGGESTED SOLDER
PAD LAYOUT
Peak Pulse Power
P_PPM Minimum Watts
0.185
Disspation on 10/1000us
1500
waveform(Note1,2,Fig1)
Peak forward surge
current (JEDEC
Method) (Note 2,3)
Operation And Storage
Temperature Range
I_FSM)
T_J,
T_STG
200.0 Amps
-55^oC to
+150^oC
0.121”
0.060”
NOTES:
1. Non-repetitive current pulse per Fig.3 and derated above TA=25^oC per Fig.2.
2. Mounted on 8.0mm² copper pads to each terminal.
3. 8.3ms, single half sine-wave or equivalent square wave, duty cycle=4 pulses per. Minutes maximum.
Version: 3
www.mccsemi.com
2003/01/01