SMBJ5363B-TP Datasheet, PDF (1/5 Pages) Micro Commercial Components – 5 Watt Surface Mount Silicon Zener Diode 5.1 to 200 Volts

MCC
TM
Micro Commercial Components

  omponents
20736 Marilla Street Chatsworth

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SMBJ5338B
THRU
SMBJ5388B
Features
x Low Profile Package for Surface Mountiong(Flat Handling
Surface for Accurate Placement)
x Zener Voltage 5.1V to 200V
x High Surge Current Capability
x For Available Tolerances-see Note 1
x Available on Tape and Reel (see E1A std RS-481)
• Lead Free Finish/Rohs Compliant (Note1) ("P"Suffix designates
Compliant. See ordering information)
• Halogen free available upon request by adding suffix "-HF"
Mechanical Data
x Standard JEDEC Outlines as Shown
x Marking: See page 2
x Maximum Temperature for Soldering: 260к for 10 Seconds
• Epoxy meets UL 94 V-0 flammability rating
• Moisture Sensitivity Level 1
5 Watt
Surface Mount Silicon
Zener Diode
5.1 to 200 Volts
DO-214AA
(SMB) (Lead Frame)
H
J
Electrical Characteristics @ 25qC Unless Otherwise Specified
Forward Voltage at
1.0A Current
Steady State Power
Dissipation
V_F
P_(AV)
1.2Volts
5Watts See Note 2
Operating and Storage
Temperatures
T_J, T_STG
-55к to +150к
Thermal Resistance
R _șJL
R _șJA
15к/W
90к/W
Note: 1.High Tempertaure Solder Exemptions Applied,see EU Directive Annex 7.
2. Lead temperature at 75к = TL at mounting plane. Derate linearly
above 75к to zero power at 150 к
3. Ambient temperature at 15к = TA at mounting plane. Derate linearly
above 15к to zero power at 150 к
A
E
D
G
DIMENSIONS
INCHES
DIM
MIN
MAX
A
.075
.095
B
.077
.083
C
.002
.008
D
-----
.02
E
.030
.060
G
.200
.220
H
.160
.187
J
.130
.155
MM
MIN
1.91
1.96
.05
-----
.76
5.08
4.06
3.30
C
B
MAX
2.41
2.10
.20
.51
1.52
5.59
4.75
3.94
NOTE
SUGGESTED SOLDER
PAD LAYOUT
0.090"
0.085”
0.070”
Revision: I
www.mccsemi.com
1 of 5
2013/01/01