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S8550-C-AP Datasheet, PDF (1/2 Pages) Micro Commercial Components – PNP Silicon Transistors
MCC
TM
Micro Commercial Components
  omponents
20736 Marilla Street Chatsworth

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Features
• TO-92 Plastic-Encapsulate Transistors
• Capable of 0.625Watts(Tamb=25OC) of Power Dissipation.
• Collector-current 0.5A
• Collector-base Voltage 40V
• Operating and storage junction temperature range: -55OC to +150OC
• Marking: S8550
• Lead Free Finish/RoHS Compliant ("P" Suffix designates
RoHS Compliant. See ordering information)
• Case Material: Molded Plastic. UL Flammability
Classification Rating 94V-0 and MSL Rating 1
• Halogen free available upon request by adding suffix "-HF"
S8550-B
S8550-C
S8550-D
PNP Silicon
Transistors
TO-92
A
E
Electrical Characteristics @ 25OC Unless Otherwise Specified
Symbol
Parameter
Min Max Units
OFF CHARACTERISTICS
V(BR)CBO
Collector-Base Breakdown Voltage
(IC=100uAdc, IE=0)
V(BR)CEO
Collector-Emitter Breakdown Voltage
(IC=0.1mAdc, IB=0)
V(BR)EBO
Emitter-Base Breakdown Voltage
(IE=100uAdc, IC=0)
ICBO
Collector Cutoff Current
(VCB=40Vdc, IE=0)
ICEO
Collector Cutoff Current
(VCE=20Vdc, IB=0)
IEBO
Emitter Cutoff Current
(VEB=3.0Vdc, IC=0)
ON CHARACTERISTICS
40
---
Vdc
25
---
Vdc
5.0
---
Vdc
---
0.1 uAdc
---
0.2 uAdc
---
0.1 uAdc
hFE(1)
DC Current Gain
(IC=50mAdc, VCE=1.0Vdc)
hFE(2)
DCCurrent Gain
(IC=500mAdc, VCE=1.0Vdc)
VCE(sat)
Collector-Emitter Saturation Voltage
(IC=500mAdc, IB=50mAdc)
VBE(sat)
Base-Emitter Saturation Voltage
(IC=500mAdc, IB=50mAdc)
VEB
Base- Emitter Voltage
(IE=100mAdc)
SMALL-SIGNAL CHARACTERISTICS
85
300
---
40
---
---
---
0.6
Vdc
---
1.2
Vdc
---
1.4
Vdc
fT
Transistor Frequency
150
---
MHz
(IC=20mAdc, VCE=6.0Vdc, f=30MHz)
CLASSIFICATION OF HFE (1)
Rank
Range
B
85-150
C
120-200
D
160-300
B
C
D
E
BC
E
BC
STRAIGHT LEAD BENT LEAD
G
BULK PACK AMMO PACK
DIMENSIONS
INCHES
MM
DIM
MIN
MAX
MIN
MAX
NOTE
A
.175
.185
4.45
4.70
B
.175
.185
4.45
4.70
C
.500
---
12.70
---
D
.016
.020
0.41
0.63
E
.135
.145
3.43
3.68
G
.095
.173
.105
2.42
2.67 Straight Lead
.220
4.40
5.60 Bent Lead
* For ammo packing detailed specification, click here to visit our website
of product packaging for details.
Revision: D
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2013/01/01