S3MB-TP Datasheet, PDF (1/3 Pages) Micro Commercial Components – Halogen free available upon request by adding suffix "-HF"

MCC
TM
Micro Commercial Components

  omponents
20736 Marilla Street Chatsworth

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$ %    !"#
Features
• Halogen free available upon request by adding suffix "-HF"
• Epoxy meets UL 94 V-0 flammability rating
• Moisture Sensitivity Level 1
• Low forward voltage drop and high current capability
• Glass passivated die construction
• Surge overload rating to 100A peak
• Ideally suited for automatic assembly
• Lead Free Finish/Rohs Compliant (Note1) ("P"Suffix designates
Compliant. See ordering information)
Maximum Ratings
• Terminals: Solder Plated Terminal – Solderable per MIL-STD-202,
Method 208
• Polarity: Cathode Band
• Weight: 0.093 grams (approx)
S3AB
THRU
S3MB
3.0 Amp Glass
Passivated Rectifier
50 to 1000 Volts
DO-214AA
(SMB) (LEAD FRAME)
A
MCC
Catalog
Number
S3AB
S3BB
S3DB
S3GB
S3JB
S3KB
S3MB
Device
Marking
S3AB
S3BB
S3DB
S3GB
S3JB
S3KB
S3MB
Maximum
Recurrent
Peak Reverse
Voltage
50V
100V
200V
400V
600V
800V
1000V
Maximum
RMS
Voltage
35V
70V
140V
280V
420V
560V
700V
Maximum
DC
Blocking
Voltage
50V
100V
200V
400V
600V
800V
1000V
Electrical Characteristics @ 25^OC Unless Otherwise Specified
Average Forward
Current
I_O
3.0A T_T = 75^OC
Peak Forward Surge
I_FSM
Current
100A 8.3ms, half sine
Maximum
Instantaneous
Forward Voltage
Maximum DC
Reverse Current At
Rated DC Blocking
Voltage
V_F
1.15V I_FM = 3.0A;
T_J = 25^OC
I_R
10uA T_J = 25^OC
250uA T_J = 125^OC
Typical Junction
Capacitance
C_J
40pF Measured at
1.0MHz, V_R=4.0V
Note: 1. High Temperature Solder Exemptions Applied, see EU Directive Annex 7.
B
C
F
H
D
G
E
DIMENSIONS
INCHES
DIM
MIN
MAX
A
.160
.185
B
.130
.155
C
.006
.012
D
.030
.060
E
.200
.220
F
.079
.103
G
.075
.087
H
.002
.008
MM
MIN
4.06
3.30
0.15
0.76
5.08
2.01
1.91
0.05
MAX
4.70
3.94
0.31
1.. 52
5.59
2.62
2.21
0.203
SUGGESTED SOLDER
PAD LAYOUT
0.106
NOTE
0.083”
0.050”
Revision: B
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2013/01/01