S2D-LTP Datasheet, PDF (1/4 Pages) Micro Commercial Components – 1.5 Amp Glass Passivated Silicon Rectifier 50 to 1000 Volts

MCC
TM
Micro Commercial Components

  omponents
20736 Marilla Street Chatsworth

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Features
• Lead Free Finish/Rohs Compliant (Note1) ("P"Suffix designates
Compliant. See ordering information)
• High Current Capability
• Low Forward Voltage Drop.
• For Surface Mount Applications
• High Temp Soldering: 260°C for 10 Seconds At Terminals
• Case Material: Molded Plastic. UL Flammability
Classification Rating 94V-0 and MSL rating 1
Maximum Ratings
• Operating Temperature: -55°C to +150°C
• Storage Temperature: -55°C to +150°C
• Typical Thermal Resistance; 20°C/W Junction To Lead
S2A-LT
THRU
S2M-LT
1.5 Amp
Glass Passivated
Silicon Rectifier
50 to 1000 Volts
DO-214AA
(SMB) (Lead Frame)
H
MCC
Part
Number
S2A-LT
S2B-LT
S2D-LT
S2G-LT
S2J-LT
S2K-LT
S2M-LT
Device
Marking
S2A
S2B
S2D
S2G
S2J
S2K
S2M
Maximum
Recurrent
Peak Reverse
Voltage
50V
100V
200V
400V
600V
800V
1000V
Maximum
RMS
Voltage
35V
70V
140V
280V
420V
560V
700V
Maximum
DC
Blocking
Voltage
50V
100V
200V
400V
600V
800V
1000V
Electrical Characteristics @ 25°C Unless Otherwise Specified
Average Forward
current
I_F(AV)
1.5A T_J = 100°C
Peak Forward Surge
Current
I_FSM
50A
8.3ms, half sine
wave
Maximum
Instantaneous
Forward Voltage
V_F
1.15V
I_FM =1.5A;
T_J = 25°C*
Maximum DC
Reverse Current At
Rated DC Blocking
Voltage
I_R
5.0µA T_J = 25°C
125µA T_J = 125°C
Typical Junction
Capacitance
C_J
20pF Measured at
1.0MHz, V_R=4.0V
*Pulse tes t: Pulse width 300 µsec, Duty cycle 2%
Note: 1. High Temperature Solder Exemptions Applied, see EU Directive Annex 7.
J
A
C
E
D
G
DIMENSIONS
INCHES
DIM
MIN
MAX
A
.075
.095
B
.077
.083
C
.002
.008
D
-----
.02
E
.030
.060
G
.200
.220
H
.160
.187
J
.130
.155
MM
MIN
1.91
1.96
.05
-----
.76
5.08
4.06
3.30
B
MAX
2.41
2.10
.20
.51
1.52
5.59
4.75
3.94
NOTE
SUGGESTED SOLDER
PAD LAYOUT
0.090"
0.085”
0.070”
Revision: 7
www.mccsemi.com
1 of 4
2008/02/01