MMSZ5221B Datasheet, PDF (1/4 Pages) Pan Jit International Inc. – SURFACE MOUNT SILICON ZENER DIODES

MCC

  omponents
21201 Itasca Street Chatsworth

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MMSZ5221B
THRU
MMSZ5259B
Features
l Planar Die construction
l 500mW Power Dissipation
l Zener Voltages from 2.4V - 39V
l Ideally Suited for Automated Assembly Processes
Mechanical Data
l Case: SOD-123, Molded Plastic
l Terminals: Solderable per MIL-STD-202, Method 208
l Approx. Weight: 0.008 grams
l Mounting Position: Any
l Storage & Operating Temperature: -55^oC to +150^oC
Maximum Ratings @ 25^oC Unless Otherwise Specified
Zener Current
I_F
Maximum Forward V_F
Voltage
Power Dissipation
(No te s A)
P_(AV)
Pe ak Forward S urge IFSM
Current (Not e s B)
100
mA
1. 2
V
500 mWatt
4.0
Amps
NOTES:
A. Mounted on 5.0mm2(.013mm thick) land areas.
B. Measured on 8.3ms, single half sine-wave or equivalent
square wave, duty cycle = 4 pulses per minute maximum.
500 mW
Zener Diodes
2.4 to 39 Volts
SOD123
A
B
C
E
F
D
H
G
DIMENSIONS
DIM
INCHES
MM
MIN MAX MIN MAX
A .141 .154 3.60 3.90
B .098 .110 2.50 2.80
C .055 .071 1.40 1.80
D .037 .053 0.95 1.35
E .019 .028 0.50 0.70
F --- .008 --- 0.20
G .016
--- 0.40
---
H --- .005 --- 0.12
NOTE
SUGGESTED SOLDER
PAD LAYOUT
2.0 "
MAX
1.50”
1.50 ”
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