MMSD914 Datasheet, PDF (1/2 Pages) Fairchild Semiconductor – High Conductance Fast Diode

MCC
TM
Micro Commercial Components

  omponents
20736 Marilla Street Chatsworth

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MMSD914
Features
x Compact surface mount with same footprint as Minimelf
x 400 milliwatt Power Dissipation package
x High Breakdown Voltage, Fast Switching Speed
• Lead Free Finish/Rohs Compliant ("P"Suffix designates
RoHS Compliant. See ordering information)
x Marking:5D
• Lead Free Finish/RoHS Compliant("P" Suffix
designates RoHS Compliant. See ordering information)
• Epoxy meets UL 94 V-0 flammability rating
• Moisture Sensitivity Level 1
Maximum Ratings
Symbol
Rating
Rating
Unit
W_iV
Working Inverse Voltage
75
V
I_FM
Forward Continuous Current
600
mA
I_O
Average Rectified Output Current
200
mA
I_FSM
Peak Forward Surge Current @1.0­s
@1.0s
2.0
1.0
A
R©_JA
P_D
T_J
T_STG
Thermal Resistance Junction to Ambient
Power dissipation
Junction Temperature
Storage Temperature
312
400
-55 to +150
-55 to +150
к/W
mW
к
к
Electrical Characteristics @ 25^OC Unless Otherwise Specified
Symbol
V_(BR)
I_R
V_F
C_T
t_rr
Parameter
Reverse Breakdown Voltage
Reverse Voltage Leakage
Current
Forward Voltage
Total Capacitance
Reverse Recovery Time
Min
100V
75V
Max
5­A
25nA
1.0V
4pF
4ns
Test Conditions
I_R=100­A
I_R=5­A
V_R=75V
V_R=20V
I_F=10mA
V_R=0V, f=1MHZ
V_R=6V, I_rr =0.1x I_R
I_F= I_R =10mA
400mW Fast
Switching Diodes
SOD123
A
B
C
E
H
D
G
J
DIMENSIONS
DIM
INCHES
MM
NOTE
MIN MAX MIN MAX
A .140 .152 3.55 3.85
B
.100
.112
2.55
2.85
C .055 .071 1.40 1.80
D
-----
.053
-----
1.35
E .012 .031
0.30
.78
G .006
-----
0.15
-----
H -----
.01
-----
.25
J ----- .006
-----
.15
SUGGESTED SOLDER
PAD LAYOUT
0.093
0.048”
0.036”
Revision: A
www.mccsemi.com
1 of 2
2011/01/01