MMBTA92_11 Datasheet, PDF (1/3 Pages) Micro Commercial Components – PNP Silicon High Voltage Transistor

MCC
TM
Micro Commercial Components

  omponents
20736 Marilla Street Chatsworth

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Features
• Surface Mount SOT-23 Package
• Capable of 300mWatts of Power Dissipation
• Lead Free Finish/RoHS Compliant ("P" Suffix designates
RoHS Compliant. See ordering information)
• Epoxy meets UL 94 V-0 flammability rating
• Moisure Sensitivity Level 1
• Marking: 2D
Electrical Characteristics @ 25^OC Unless Otherwise Specified
Symbol
Parameter
OFF CHARACTERISTICS
V(BR)CEO
V(BR)CBO
V(BR)EBO
IC
Collector-Emitter Breakdown Voltage*
(IC=-1.0mAdc, IB=0)
Collector-Base Breakdown Voltage
(IC=-100µAdc, IE=0)
Emitter-Base Breakdown Voltage
(IE=-100µAdc, IC=0)
Collector Current-Continuous
Min
-300
-300
-5
-300
Max Units
Vdc
Vdc
Vdc
mAdc
ICBO
IEBO
Collector Cutoff Current
(VCB=-200Vdc, IE=0)
Emitter Cutoff Current
(VEB=-5Vdc, IC=0)
ON CHARACTERISTICS
hFE
VCE(sat)
DC Current Gain*
(IC=-1.0mAdc, VCE=-10Vdc)
(IC=-10mAdc, VCE=-10Vdc)
(IC=-30mAdc, VCE=-10Vdc)
Collector-Emitter Saturation Voltage
(IC=-20mAdc, IB=-2.0mAdc)
-250
-100
nAdc
nAdc
60
100
200
60
-0.2
Vdc
VBE(sat)
Base-Emitter Saturation Voltage
(IC=-20mAdc,IB=-2.0mAdc)
SMALL-SIGNAL CHARACTERISTICS
fT
Current Gain-Bandwidth Product
(IC=-10mAdc, VCE=-20Vdc, f=30MHz)
50
Ccb
Collector-Base Capacitance
(VCB=-20Vdc, IE=0, f=1.0MHz)
-0.9
Vdc
MHz
6.0
pF
THERMAL CHARACTERISTICS
Characteristic
Total Device Dissipation FR–5 Board,(1)
TA = 25°C
Derate above 25°C
Thermal Resistance, Junction to Ambient
Total Device Dissipation
Alumina Substrate,(2) TA = 25°C
Derate above 25°C
Thermal Resistance, Junction to Ambient
Junction and Storage Temperature
Symbol
PD
R_qJA
PD
R_qJA
TJ, Tstg
Max
Unit
225
mW
1.8
mW/°C
556
°C/W
300
mW
2.4
417
–55 to +150
mW/°C
°C/W
°C
MMBTA92
PNP Silicon High
Voltage Transistor
SOT-23
A
D
C
CB
F
E
B
E
G
H
K
DIMENSIONS
INCHES
DIM
MIN
MAX
A
.110
.120
B
.083
.098
C
.047
.055
D
.035
.041
E
.070
.081
F
.018
.024
G
.0005
.0039
H
.035
.044
J
.003
.007
K
.015
.020
MM
MIN
2.80
2.10
1.20
.89
1.78
.45
.013
.89
.085
.37
MAX
3.04
2.64
1.40
1.03
2.05
.60
.100
1.12
.180
.51
NOTE
Suggested Solder
Pad Layout
.031
.800
.035
.900
.079
2.000
inches
mm
.037
.950
.037
.950
Revision: A
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2011/01/01