MMBTA43 Datasheet, PDF (1/3 Pages) Zowie Technology Corporation – HIGH VOLTAGE TRANSISTOR NPN SILICON

MCC
TM
Micro Commercial Components

  omponents
20736 Marilla Street Chatsworth

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MMBTA43
Features
• Surface Mount SOT-23 Package
• Capable of 300mWatts of Power Dissipation
• Lead Free Finish/RoHS Compliant ("P" Suffix designates
RoHS Compliant. See ordering information)
• Epoxy meets UL 94 V-0 flammability rating
• Moisure Sensitivity Level 1
• Marking: M1E, ABX
Electrical Characteristics @ 25°C Unless Otherwise Specified
Symbol
Parameter
Min
Max Units
OFF CHARACTERISTICS
V(BR)CEO
V(BR)CBO
V(BR)EBO
ICBO
IEBO
Collector-Emitter Breakdown Voltage*
(IC=1.0mAdc, IB=0)
Collector-Base Breakdown Voltage
(IC=100µAdc, IE=0)
Emitter-Base Breakdown Voltage
(IE=100µAdc, IC=0)
Collector Cutoff Current
(VCB=160Vdc, IE=0)
Emitter Cutoff Current
(VEB=4.0Vdc, IC=0)
ON CHARACTERISTICS
200
Vdc
200
Vdc
6.0
Vdc
0.1
uAdc
0.1
uAdc
hFE
DC Current Gain*
(IC=1.0mAdc, VCE=10Vdc)
(IC=10mAdc, VCE=10Vdc)
(IC=30mAdc, VCE=10Vdc)
25
40
----
40
VCE(sat)
Collector-Emitter Saturation Voltage
(IC=20mAdc, IB=2.0mAdc)
0.5
Vdc
VBE(sat)
Base-Emitter Saturation Voltage
(IC=20mAdc, IB=2.0mAdc)
0.9
Vdc
SMALL-SIGNAL CHARACTERISTICS
fT
Current Gain-Bandwidth Product
(IC=10mAdc, VCE=20Vdc, f=100MHz)
Ccb
Collector-Emitter Capacitance
(VCB=20Vdec, IE=0, f=1.0MHz)
THERMAL CHARACTERISTICS
Characteristic
Symbol
Total Device Dissipation FR–5 Board,⁽¹⁾
P_D
T_A = 25°C
Derate above 25°C
Thermal Resistance, Junction to Ambient
Total Device Dissipation
Alumina Substrate,⁽²⁾ T_A = 25°C
Derate above 25°C
R_qJA
P_D
Thermal Resistance, Junction to Ambient
Junction and Storage Temperature
R_qJA
T_J, T_stg
*Pulse Width ≤ 300µs, Duty Cycle ≤ 2.0%
50
4.0
Max
225
1.8
556
300
2.4
417
–55 to +150
MHz
pF
Unit
mW
mW/°C
°C/W
mW
mW/°C
°C/W
°C
NPN Silicon High
Voltage Transistor
SOT-23
A
D
C
CB
F
E
B
E
G
H
J
K
DIMENSIONS
INCHES
DIM
MIN
MAX
A
.110
.120
B
.083
.098
C
.047
.055
D
.035
.041
E
.070
.081
F
.018
.024
G
.0005
.0039
H
.035
.044
J
.003
.007
K
.015
.020
MM
MIN
MAX
2.80
3.04
2.10
2.64
1.20
1.40
.89
1.03
1.78
2.05
.45
.60
.013
.100
.89
1.12
.085
.180
.37
.51
NOTE
Suggested Solder
Pad Layout
.031
.800
.035
.900
.079
2.000
inches
mm
.037
.950
.037
.950
Revision: A
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2011/01/01