MMBTA42_08 Datasheet, PDF (1/3 Pages) Micro Commercial Components – NPN Silicon High Voltage Transistor

MCC
TM
Micro Commercial Components

  omponents
20736 Marilla Street Chatsworth

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$ %    !"#
MMBTA42
Features
• Surface Mount SOT-23 Package
• Capable of 300mWatts of Power Dissipation
• Continuous Collector Current : 300mA
x Case Material: Molded Plastic. UL Flammability
Classification Rating 94V-0 and MSL Rating 1
x Marking:1D
Electrical Characteristics @ 25^OC Unless Otherwise Specified
Symbol
Parameter
Min
Max Units
OFF CHARACTERISTICS
V(BR)CEO
V(BR)CBO
V(BR)EBO
ICBO
IEBO
Collector-Emitter Breakdown Voltage*
(IC=1.0mAdc, IB=0)
Collector-Base Breakdown Voltage
(IC=100µAdc, IE=0)
Emitter-Base Breakdown Voltage
(IE=100µAdc, IC=0)
Collector Cutoff Current
(VCB=200Vdc, IE=0)
Emitter Cutoff Current
(VEB=6.0Vdc, IC=0)
ON CHARACTERISTICS
300
300
6.0
0.1
0.1
Vdc
Vdc
Vdc
uAdc
uAdc
hFE
DC Current Gain*
(IC=1.0mAdc, VCE=10Vdc)
(IC=10mAdc, VCE=10Vdc)
(IC=30mAdc, VCE=10Vdc)
25
40
----
40
VCE(sat)
Collector-Emitter Saturation Voltage
(IC=20mAdc, IB=2.0mAdc)
0.5
Vdc
VBE(sat)
Base-Emitter Saturation Voltage
(IC=20mAdc, IB=2.0mAdc)
0.9
Vdc
SMALL-SIGNAL CHARACTERISTICS
fT
Current Gain-Bandwidth Product
(IC=10mAdc, VCE=20Vdc, f=100MHz)
Ccb
Collector-Emitter Capacitance
(VCB=20Vdec, IE=0, f=1.0MHz)
THERMAL CHARACTERISTICS
Characteristic
Symbol
Total Device Dissipation FR–5 Board,⁽¹⁾
P_D
T_A = 25°C
Derate above 25°C
Thermal Resistance, Junction to Ambient
Total Device Dissipation
Alumina Substrate,⁽²⁾ T_A = 25°C
Derate above 25°C
R_qJA
P_D
Thermal Resistance, Junction to Ambient
Junction and Storage Temperature
R_qJA
T_J, T_stg
*Pulse Width ≤ 300µs, Duty Cycle ≤ 2.0%
50
MHz
3.0
pF
Max
225
1.8
556
300
2.4
417
–55 to +150
Unit
mW
mW/°C
°C/W
mW
mW/°C
°C/W
°C
NPN Silicon High
Voltage Transistor
SOT-23
A
D
C
CB
F
E
B
E
G
H
J
K
DIMENSIONS
INCHES
DIM
MIN
MAX
A
.110
.120
B
.083
.098
C
.047
.055
D
.035
.041
E
.070
.081
F
.018
.024
G
.0005
.0039
H
.035
.044
J
.003
.007
K
.015
.020
MM
MIN
2.80
2.10
1.20
.89
1.78
.45
.013
.89
.085
.37
MAX
3.04
2.64
1.40
1.03
2.05
.60
.100
1.12
.180
.51
NOTE
Suggested Solder
Pad Layout
.031
.800
.035
.900
.079
2.000
inches
mm
.037
.950
.037
.950
Revision: 5
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2008/01/01