MMBT3904_08 Datasheet, PDF (1/5 Pages) Micro Commercial Components – NPN General Purpose Amplifier

MCC
TM
Micro Commercial Components

  omponents
20736 Marilla Street Chatsworth

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$ %    !"#
MMBT3904
Features
• Capable of 350mWatts of Power Dissipation and 200mA Ic.
x Operating and Storage Junction Temperatures: -55ć to 150ć
x Surface Mount SOT-23 Package
• Case Material:Molded Plastic. UL Flammability
Classificatio Rating 94-0 and MSL Rating 1
x Marking:1AM
Electrical Characteristics @ 25°C Unless Otherwise Specified
Symbol
Parameter
Min
Max Units
OFF CHARACTERISTICS
V(BR)CEO
Collector-Emitter Breakdown Voltage*
40
Vdc
(IC=1.0mAdc, IB=0)
V(BR)CBO
Collector-Base Breakdown Voltage
60
Vdc
(IC=10µAdc, IE=0)
V(BR)EBO
Emitter-Base Breakdown Voltage
6.0
Vdc
(IE=10µAdc, IC=0)
ICBO
Collector Cutoff Current
50
nAdc
(VCB=30Vdc, VBE=3.0Vdc)
ICEX
Collector Cutoff Current
50
nAdc
(VCE=30Vdc, VBE=3.0Vdc)
ON CHARACTERISTICS
hFE
VCE(sat)
VBE(sat)
DC Current Gain*
(IC=0.1mAdc, VCE=1.0Vdc)
(IC=1.0mAdc, VCE=1.0Vdc)
(IC=10mAdc, VCE=1.0Vdc)
(IC=50mAdc, VCE=1.0Vdc)
(IC=100mAdc, VCE=1.0Vdc)
Collector-Emitter Saturation Voltage
(IC=10mAdc, IB=1.0mAdc)
(IC=50mAdc, IB=5.0mAdc)
Base-Emitter Saturation Voltage
(IC=10mAdc, IB=1.0mAdc)
(IC=50mAdc, IB=5.0mAdc)
SMALL-SIGNAL CHARACTERISTICS
40
70
100
300
60
30
0.2
Vdc
0.3
0.65
0.85
Vdc
0.95
fT
Current Gain-Bandwidth Product
(IC=10mAdc, VCE=20Vdc, f=100MHz)
300
MHz
Cobo
Output Capacitance
(VCB=5.0Vdec, IE=0, f=1.0MHz)
4.0
pF
Cibo
Input Capacitance
(VBE=0.5Vdc, IC=0, f=1.0MHz)
8.0
pF
NF
Noise Figure
(IC=100µAdc, VCE=5.0Vdc, RS=1.0kΩ
5.0
dB
f=10Hz to 15.7kHz)
SWITCHING CHARACTERISTICS
td
Delay Time
(VCC=3.0Vdc, VBE=0.5Vdc
tr
Rise Time
IC=10mAdc, IB1=1.0mAdc)
ts
Storage Time (VCC=3.0Vdc, IC=10mAdc
tf
Fall Time
IB1=IB2=1.0mAdc)
*Pulse Width ≤ 300µs, Duty Cycle ≤ 2.0%
35
ns
35
ns
200
ns
50
ns
NPN General
Purpose Amplifier
SOT-23
A
D
C
CB
F
E
B
E
G
H
J
K
DIMENSIONS
INCHES
DIM
MIN
MAX
A
.110
.120
B
.083
.098
C
.047
.055
D
.035
.041
E
.070
.081
F
.018
.024
G
.0005
.0039
H
.035
.044
J
.003
.007
K
.015
.020
MM
MIN
2.80
2.10
1.20
.89
1.78
.45
.013
.89
.085
.37
MAX
3.04
2.64
1.40
1.03
2.05
.60
.100
1.12
.180
.51
NOTE
Suggested Solder
Pad Layout
.031
.800
.035
.900
.079
2.000
inches
mm
.037
.950
.037
.950
Revision: 5
www.mccsemi.com
1 of 5
2008/01/01