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MMBD914_11 Datasheet, PDF (1/3 Pages) Micro Commercial Components – 350mW 100 Volt Silicon Epitaxial Diode
MCC
TM
Micro Commercial Components
  omponents
20736 Marilla Street Chatsworth

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MMBD914
Features
• Low Current Leakage
• Low Cost
• Small Outline Surface Mount Package
• Lead Free Finish/Rohs Compliant ("P"Suffix designates
RoHS Compliant. See ordering information)
C
Pin Configuration
Top View
5D
A
Maximum Ratings
• Operating Temperature: -55°C to +150°C
• Storage Temperature: -55°C to +150°C
• Maximum Thermal Resistance; 357K/W Junction To Ambient
• Epoxy meets UL 94 V-0 flammability rating
• Moisture Sensitivity Level 1
Electrical Characteristics @ 25°C Unless Otherwise Specified
Reverse Voltage
Peak Reverse
Voltage
VR
75V
VRM
100V
Average Rectified
Current
IO
150mA Resistive Load
f > 50Hz
Power Dissipation
Junction
Temperature
PTOT
TJ
350mW
175°C
Peak Forward Surge
IFSM
Current
1.0A t=1s,Non-Repetitive
Maximum
Instantaneous
VF
.855V IFM = 10mA;
Forward Voltage
TJ = 25°C*
Maximum DC
Reverse Current At
IR
25nA TJ = 25°C
Rated DC Blocking
VR =20Volts
Voltage
Typical Junction
CJ
2pF Measured at
Capacitance
1.0MHz, VR=0V
Reverse Recovery
Trr
4nS IF=10mA
Time
VR = 6V
RL=100Ω
*Pulse test: Pulse width 300 µsec, Duty cycle 2%
350mW 100 Volt
Silicon Epitaxial Diode
SOT-23
A
D
CB
F
E
G
H
J
DIMENSIONS
INCHES
DIM
MIN
MAX
A
.110
.120
B
.083
.098
C
.047
.055
D
.035
.041
E
.070
.081
F
.018
.024
G
.0005
.0039
H
.035
.044
J
.003
.007
K
.015
.020
MM
MIN
2.80
2.10
1.20
.89
1.78
.45
.013
.89
.085
.37
MAX
3.04
2.64
1.40
1.03
2.05
.60
.100
1.12
.180
.51
Suggested Solder
Pad Layout
.031
.800
NOTE
.035
.900
.079
2.000
inches
mm
.037
.950
.037
.950
Revision: A
www.mccsemi.com
1 of 3
2011/01/01