MMBD4148CA Datasheet, PDF (1/2 Pages) Micro Commercial Components – High Conductance Ultra Fast Diode 350mW

MCC

  omponents
21201 Itasca Street Chatsworth

  !"#
$ %    !"#
Features
l Surface Mount Package Ideally Suited for Automatic Insertion
l 150^oC Junction Temperature
l High Conductance
Mechanical Data
l Case: SOT-23, Molded Plastic
l Terminals: Solderable per MIL-STD-202, Method 208
l Marking: D6
l Weight: 0.008 grams ( approx.)
Maximum Ratings @ 25^oC Unless Otherwise Specified
Characteristic
Symbol
Value
Unit
Working Inverse Voltage
VIV
75
V
DC Forward Current
IF M
600
mA
Average Rectified Current
IF(AV)
200
mA
Recurrent Peak Forward Current
IFRM
700
mA
Peak Forward Surge Current@ t=1.0s
@ t=1.0us
IFSM
1.0
2.0
A
Power Dissipation
Pd
350
mW
Thermal Resistance
R
357
o _C/W
Operation & Storage Temp. Range
Tj, TSTG -55 to +150
o_C
Note:1) These ratings are based on a max. junction temperature of 150 degrees C
2) These are steady state limits. The factory should be consulted on applications
involving pulsed or low duty cycle operation
Electrical Characteristics @ 25^oC Unless Otherwise Specified
Charateristic
Symbol Min
Breakdown Voltage
V_R
75
Maximum
Instantaneous
V_F
Forward Voltage
Maximum
Instantaneous Reverse IR
Current
Junction Capacitance C_j
Reverse Recovery
Time
t_rr
Max Unit
Test Cond.
V IR=100uA
1.0 V IF=10mA
25 nA ^VR^=20V
50 uA V_R=20V T_A=150^oC
5.0 uA V_R=75V
4 pF V_R=0V, f=1.0MHz
I_F=10mA, V_R=6.0V,
4 ns IRR=1.0mA,
R_L=100 OHM
MMBD4148CA
High Conductance
Ultra Fast Diode
350mW
SOT-23
A
D
CB
F
E
G
H
J
K
DIMENSIONS
INCHES
DIM
MIN
MAX
A
.110
.120
B
.083
.098
C
.047
.055
D
.035
.041
E
.070
.081
F
.018
.024
G
.0005
.0039
H
.035
.044
J
.003
.007
K
.015
.020
MM
MIN
2.80
2.10
1.20
.89
1.78
.45
.013
.89
.085
.37
MAX
3.04
2.64
1.40
1.03
2.05
.60
.100
1.12
.180
.51
Suggested Solder
Pad Layout
.031
.800
NOTE
.035
.900
.079
2.000
inches
mm
.037
.950
.037
.950
www.mccsemi.com