LS4148 Datasheet, PDF (1/2 Pages) Vishay Siliconix – Silicon Epitaxial Planar Diodes

MCC
TM
Micro Commercial Components

  omponents
20736 Marilla Street Chatsworth

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LS4148
Features
• Hermetically sealed glass
• Glass Passivated
• Lead Free Finish/Rohs Compliant (Note1) ("P"Suffix designates
Compliant. See ordering information)
• Epoxy meets UL 94 V-0 flammability rating
M^• a^Mxi^om^istuu^rem^SeR^nsa^itit^vi^itn^{y L}g^es^{vel 1}
Reverse Voltage
Forward Current
Power Dissipation
3.33mW/^OC(25^OC)
Operating Junction Temp.
Storage Temp.
VR
75
V
I_F
150
mA
P
500
mW
T_j
-65 to 175
O_C
T_stg
-65 to 175
O_C
Electrical Characteristics @ 25°C Unless Otherwise Specified
Minimum Breakdown
Voltage
Peak Forward Surge
Current
Maximum Forward
Voltage
Maximum Reverse
Current
Maximum Junction
Capacitance
Maximum Reverse
Recovery Time
Maximum Thermal
Resistance*
BV
I_Fsurge
V_F
I_R
Cj
trr
R_JA
100V I_R=100uA
2.0A Tp=1.0usec.
1.0V
I_F=10mA
0.025uA
5.0uA
50uA
4.0pF
4.0ns
500^OC/W
V_R=20V
V_R=75V
V_R=20V,T_j=150^OC
V_R=0,
f=1.0MHz
I_F=10mA,
V_R=6.0V,
I_RR=1.0mA,
R_L=100 OHM
Note: 1. Lead in Glass Exemption Applied, see EU Directive Annex 5.
* On PC Board 50mmx50mmx1.6mm
500mW
Signal Diode
Quadro MELF
Cathode Mark
C
D
B
A
DIMENSIONS
INCHES
DIM
MIN
MAX
A
.130
.146
B
.008
.016
C
.055
.063
D
.067
MM
MIN
MAX
3.30
3.70
.20
.40
1.40
1.60
1.70
SUGGESTED SOLDER
PAD LAYOUT
NOTE
∅
.155”
.065”
.022”
Revision: A
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2011/01/01