GS1A-L Datasheet, PDF (1/4 Pages) Micro Commercial Components – 1.0 Amp Glass Passivated Rectifier 50 to 1000 Volts

MCC
TM
Micro Commercial Components

  omponents
20736 Marilla Street Chatsworth

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GS1A-L
THRU
GS1M-L
Features
• Epoxy meets UL 94 V-0 flammability rating
• Moisture Sensitivity Level 1
• Extremely Low Thermal Resistance
• High Temp Soldering: 260°C for 10 Seconds At Terminals
x Lead Free Finish/Rohs Compliant (Note1) ("P"Suffix designates
Compliant. See ordering information)
Maximum Ratings
• Operating Temperature: -55°C to +150°C
• Storage Temperature: -55°C to +150°C
• Maximum Thermal Resistance; 15 °C/W Junction To Lead
1.0 Amp Glass
Passivated Rectifier
50 to 1000
Volts


DO-214
AC
(SMA) (LEAD
FRAME)
H


MCC
Catalog
Number
GS1A-L
GS1B-L
GS1D-L
GS1G-L
GS1J-L
GS1K-L
GS1M-L
Device
Marking
GS1A
GS1B
GS1D
GS1G
GS1J
GS1K
GS1M
Maximum
Reccurrent
Peak Reverse
Voltage
50V
100V
200V
400V
600V
800V
1000V
Maximum
RMS
Voltage
35V
70V
140V
280V
420V
560V
700V
Maximum
DC
Blocking
Voltage
50V
100V
200V
400V
600V
800V
1000V
Electrical Characteristics @ 25°C Unless Otherwise Specified
Average Forward
current
I_F(AV)
1.0A T_L = 110°C
Peak Forward Surge I_FSM
Current
30A 8.3ms, half sine,
Maximum
Instantaneous
Forward Voltage
I_FM = 1.0A;
V_F
1.0V T_J = 25°C*
Maximum DC
Reverse Current At
I_R
10µA T_J = 25°C
Rated DC Blocking
50µA T_J = 125°C
Voltage
Typical Junction
Capacitance
C_J
15pF Measured at
1.0MHz, V_R=4.0V
*Pulse test: Pulse width 300 µsec, Duty cycle 2%
Note 1: High Temperature Solder Exemptions Applied, see EU Directive Annex 7.
J
A
C
E
D
F
G
DIMENSIONS
INCHES
DIM
MIN
MAX
A
.079
.096
B
.050
.064
C
---
.008
D
---
.02
E
.030
.060
F
.065
.091
G
.189
.220
H
.157
.181
J
.090
.115
MM
MIN
2.00
1.27
---
---
.76
1.65
4.80
4.00
2.25
B
MAX
2.44
1.63
.20
.51
1.52
2.32
5.59
4.60
2.92
NOTE
SUGGESTED SOLDER
PAD LAYOUT
0.090”
0.085”
0.070”
Revision: C
www.mccsemi.com
1 of 4
2011/08/19