GPA801DT Datasheet, PDF (1/3 Pages) Micro Commercial Components – 8 Amp Glass Passivated Rectifier

MCC
TM
Micro Commercial Components

  omponents
20736 Marilla Street Chatsworth

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GPA801DT
thru
GPA807DT
Features
x Low Forward Voltage Drop
x High Current Capability
x High Reliability
• Lead Free Finish/RoHS Compliant(Note 1)("P" Suffix designates
Compliant. See ordering information)
• Epoxy meets UL 94 V-0 flammability rating
• Moisture Sensitivity Level 1
Maximum Ratings
8 Amp
Glass Passivated
Rectifier
D²-PACK
x Operating Temperature: -65qC to +150qC
x Storage Temperature: -65qC to +150qC
x Maximum Thermal Resistance; 2.5qC/W Junction To Case
MCC
Part
Number
GPA801DT
GPA802DT
GPA803DT
GPA804DT
GPA805DT
GPA806DT
GPA807DT
Device
Marking
GPA801DT
GPA802DT
GPA803DT
GPA804DT
GPA805DT
GPA806DT
GPA807DT
Maximum
Recurrent
Peak Reverse
Voltage
50V
100V
200V
400V
600V
800V
1000V
Maximum
RMS
Voltage
35V
70V
140V
280V
420V
560V
700V
Maximum
DC
Blocking
Voltage
50V
100V
200V
400V
600V
800V
1000V
G
D
H
J
K
S
A
1
2
3
V
4
B
C
E
Electrical Characteristics @ 25qC Unless Otherwise Specified
Average Forward
Current
I_F(AV)
8A
T_C = 100qC
Peak Forward Surge
Current
I_FSM
150A 8.3ms, half sine
Maximum
Instantaneous Forward
Voltage
V_F
1.1V
I_F = 8A;
T_J = 25qC
Maximum DC Reverse
Current At Rated DC
I_R
Blocking Voltage
5uA T_c = 25qC
Typical Junction
Capacitance
C_J
50pF Measured at
1.0MHz, V_R=4.0V
Note: 1. High Temperature Solder Exemptions Applied, see EU Directive Annex 7.
1
4
3
HEATSINK
DIMENSIONS
DIM
INCHES
MM
NOTE
MIN
MAX
MIN
MAX
A
.320
.359
8.13
9.14
B
.380
.411
9.65
10.45
C
.160
.190
4.06
4.83
D
.020
.035
0.51
0.89
E
.045
.055
1.14
1.40
G
.095
.105
2.41
2.67
H
.096
.120
2.43
3.03
J
.014
.021
0.35
0.53
K
.090
.110
2.29
2.79
S
.575
.625
14.60
15.80
V
.045
.055
1.14
1.40
SUGGESTED SOLDER PAD LAYOUT
.740
18.79
.420
10.66
.330
8.38
Inches
mm
.065
1.65
.070
1.78
.120
3.05
Revision: A
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2011/01/01