FS1AE_13 Datasheet, PDF (1/4 Pages) Micro Commercial Components – 1 Amp Fast Recovery Silicon Rectifier 50 to 1000 Volts

MCC
TM
Micro Commercial Components

  omponents
20736 Marilla Street Chatsworth

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Features
• Lead Free Finish/Rohs Compliant (Note1) ("P"Suffix designates
Compliant. See ordering information)
• Halogen free available upon request by adding suffix "-HF"
• Epoxy meets UL 94 V-0 flammability rating
• Moisture Sensitivity Level 1
• Easy Pick And Place
• High Temp Soldering: 260°C for 10 Seconds At Terminals
• Superfast Recovery Times For High Efficiency
Maximum Ratings
• Operating Temperature: -50°C to +150°C
• Storage Temperature: -50°C to +150°C
• Maximum Thermal Resistance; 15 °C/W Junction To Lead
• Maximum Thermal Resistance; 88°C/W Junction To Ambient
MCC
Catalog
Number
FS1AE
FS1BE
FS1DE
FS1GE
FS1JE
FS1KE
FS1ME
Device
Marking
FS1A
FS1B
FS1D
FS1G
FS1J
FS1K
FS1M
Maximum
Recurrent
Peak Reverse
Voltage
50V
100V
200V
400V
600V
800V
1000V
Maximum
RMS
Voltage
35V
70V
140V
280V
420V
560V
700V
Maximum
DC
Blocking
Voltage
50V
100V
200V
400V
600V
800V
1000V
Electrical Characteristics @ 25°C Unless Otherwise Specified
Average Forward
current
I_F(AV)
1.0A T_a = 90°C
Peak Forward Surge I_FSM
Current
30A 8.3ms, half sine
Maximum
Instantaneous
Forward Voltage
I_FM = 1.0A;
V_F
1.30V T_J = 25°C*
Maximum DC
Reverse Current At
Rated DC Blocking
Voltage
I_R
5µA T_J = 25°C
200µA T_J = 125°C
Maximum Reverse
Recovery Time
FS1AE-GE T_rr
FS1JE
FS1KE-ME
150ns
250ns
500ns
I_F=0.5A, I_R=1.0A,
I_rr=0.25A
Typical Junction
Capacitance
C_J
50pF Measured at
1.0MHz, V_R=4.0V
*Pulse test: Pulse width 200 µsec, Duty cycle 2%
Note: 1. High Temperature Solder Exemptions Applied, see EU Directive Annex 7.
FS1AE
THRU
FS1ME
1 Amp Fast Recovery
Silicon Rectifier
50 to 1000 Volts
(SMAE)
H
Cathode Band
J
A
C
E
D
B
G
DIMENSIONS
INCHES
DIM
MIN
MAX
A
.079
.096
B
.050
.075
C
.002
.008
D
---
.02
E
.030
.060
G
.189
.208
H
.157
.180
J
.090
.115
MM
MIN
2.01
1.27
.05
---
.76
4.80
4.00
2.29
MAX
2.44
1.90
.20
.51
1.52
5.30
4.57
2.92
NOTE
SUGGESTED SOLDER
PAD LAYOUT
0.090”
0.085”
0.070”
Revision: B
www.mccsemi.com
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2013/01/01