FR3AB_11 Datasheet, PDF (1/4 Pages) Micro Commercial Components – 3 Amp Fast Recovery Silicon Rectifier 50 to 1000 Volts

MCC
TM
Micro Commercial Components

  omponents
20736 Marilla Street Chatsworth

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Features
• Lead Free Finish/Rohs Compliant (Note1) ("P"Suffix designates
Compliant. See ordering information)
• Epoxy meets UL 94 V-0 flammability rating
• Moisture Sensitivity Level 1
• Easy Pick And Place
• High Temp Soldering: 260°C for 10 Seconds At Terminals\
• Fast Recovery Times For High Effieciency
FR3AB
THRU
FR3MB
3 Amp Fast Recovery
Silicon Rectifier
50 to 1000 Volts
Maximum Ratings
• Operating Temperature: -55°C to +150°C
• Storage Temperature: -55°C to +150°C
• Maximum Thermal Resistance; 10 °C/W Junction To Lead
DO-214AA
(SMB) (LEAD FRAME)
A
MCC
Catalog
Number
FR3AB
FR3BB
FR3DB
FR3GB
FR3JB
FR3KB
FR3MB
Device
Marking
FR3AB
FR3BB
FR3DB
FR3GB
FR3JB
FR3KB
FR3MB
Maximum
Recurrent
Peak Reverse
Voltage
50V
100V
200V
400V
600V
800V
1000V
Maximum
RMS
Voltage
35V
70V
140V
280V
420V
560V
700V
Maximum
DC
Blocking
Voltage
50V
100V
200V
400V
600V
800V
1000V
Electrical Characteristics @ 25°C Unless Otherwise Specified
Average Forward
Current
Peak Forward Surge
Current
I_F(AV)
I_FSM
3.0A
100A
T_J = 120°C
8.3ms, half sine
Maximum
Instantaneous
V_F
Forward Voltage
Maximum DC
Reverse Current At
I_R
Rated DC Blocking
Voltage
Maximum Reverse
Recovery Time
FR3AB-GB
T_rr
FR3JB
FR3KB-MB
1.30V I_FM = 3.0A;
T_J = 25°C*
10µA T_J = 25°C
250µA T_J = 100°C
150ns
250ns
500ns
I_F=0.5A, I_R=1.0A,
I_rr=0.25A
Typical Junction
Capacitance
C_J
80pF Measured at
1.0MHz, V_R=4.0V
*Pulse test: Pulse width 200 µsec, Duty cycle 2%
Note: 1. High Temperature Solder Exemptions Applied, see EU Directive Annex 7.
B
C
F
H
D
G
E
DIMENSIONS
INCHES
DIM
MIN
MAX
A
.160
.185
B
.130
.155
C
.006
.012
D
.030
.060
E
.200
.220
F
.079
.103
G
.075
.087
H
.002
.008
MM
MIN
4.06
3.30
0.15
0.76
5.08
2.01
1.91
0.05
MAX
4.70
3.94
0.31
1.. 52
5.59
2.62
2.21
0.203
SUGGESTED SOLDER
PAD LAYOUT
0.106
NOTE
0.083”
0.050”
www.mccsemi.com
Revision: A
1 of 4
2011/01/01