ER3A_11 Datasheet, PDF (1/4 Pages) Micro Commercial Components – 3 Amp Super Fast Recovery Silicon Rectifier 50 to 1000 Volts

MCC
TM
Micro Commercial Components

  omponents
20736 Marilla Street Chatsworth

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Features
• Lead Free Finish/Rohs Compliant (Note1) ("P"Suffix designates
Compliant. See ordering information)
• Epoxy meets UL 94 V-0 flammability rating
• Moisture Sensitivity Level 1
• Easy Pick And Place
• High Temp Soldering: 260°C for 10 Seconds At Terminals
• Super Fast Recovery Times For High Effieciency
ER3A
THRU
ER3M
3 Amp Super Fast
Recovery
Silicon Rectifier
50 to 1000 Volts
Maximum Ratings
• Operating Temperature: -50°C to +175°C
• Storage Temperature: -50°C to +175°C
• Typical Thermal Resistance; 16 °C/W Junction To Lead
DO-214AB
(SMC) (LEAD FRAME)
MCC
Device
Maximum Maximum Maximum
Catalog Marking Recurrent
RMS
DC
Number
Peak Reverse Voltage Blocking
Voltage
Voltage
ER3A
ER3A
50V
35V
50V
ER3B
ER3B
100V
70V
100V
ER3C
ER3C
150V
105V
150V
ER3D
ER3D
200V
140V
200V
ER3G
ER3G
400V
280V
400V
ER3J
ER3J
600V
420V
600V
ER3K
ER3K
800V
560V
800V
ER3M ER3M
1000V
700V
1000V
Electrical Characteristics @ 25°C Unless Otherwise Specified
Average Forward
Current
Peak Forward Surge
Current
Maximum
Instantaneous
Forward Voltage
ER3A-3D
ER3G
ER3J~3M
I_F(AV)
I_FSM
V_F
3.0A
100A
T_L = 75°C
8.3ms, half sine
.95V
1.25V
1.70V
I_FM = 3.0A;
T_J = 25°C*
Maximum DC
Reverse Current At
Rated DC Blocking
Voltage
I_R
5µA T_J = 25°C
200µA T_J = 100°C
G
H
D
C
A
E
B
F
DIMENSIONS
INCHES
DIM
MIN
MAX
A
.079
.103
B
.108
.128
C
.002
.008
D
.006
.012
E
.030
.050
F
..305
.320
G
.260
.280
H
.220
.245
MM
MIN
2.00
2.75
0.051
0.152
0.76
7.75
6.60
5.59
MAX
2.62
3.25
0.203
0.305
1.27
8.13
7.11
6.22
NOTE
SUGGESTED SOLDER
PAD LAYOUT
0.190
0.125”
Maximum Reverse
Recovery Time
ER3A~ER3J ^Trr
35ns
75ns
I_F=0.5A, I_R=1.0A,
I_rr=0.25A
0.070”
ER3K~ER3M
Typical Junction
Capacitance
C_J
45pF Measured at
1.0MHz, V_R=4.0V
*Pulse test: Pulse width 300 µsec, Duty cycle 2%
1. High Temperature Solder Exemptions Applied, see EU Directive Annex 7.
www.mccsemi .com
Revision: B
1 of 4
2011/05/18