English
Language : 

DL4446 Datasheet, PDF (1/4 Pages) Micro Commercial Components – 500mW 75Volt High-speed Diode
MCC
TM
Micro Commercial Components
  omponents
20736 Marilla Chatsworth

  !"#
$ %    !"#
DL4446
Features
• Small hermetically sealed glass SMD package
• High switching speed: max. 4ns
• Lead Free Finish/RoHS Compliant(Note 1) ("P" Suffix designates
Compliant. See ordering information)
• Epoxy meets UL 94 V-0 flammability rating
• Moisture Sensitivity Level 1
Maximum Ratings
• Storage Temperature: -65к to +200к
Electrical Characteristics @ 25°C Unless Otherwise Specified
Reverse Voltage
Repetitive Peak
Reverse Voltage
VR
VRRM
75V
75V
Continuous Forward
Current
IF
200mA See Fig.1; note 2
Repetitive Peak
Forward Current
IFRM 450mA
Power Dissipation
Junction
Temperature
PTOT
TJ
500mW
200к
Peak Forward Surge
Current (square
wave; Tj=25ć prior
IFSM
to surge; see Fig.3)
4A
1A
0.5A
t=1­s
t=1ms
t=1s
Maximum
Instantaneous
Forward Voltage
VF
1.0V
IFM = 20mA;
See Fig.2
Maximum DC
VR=20Volts
Reverse Current At
Rated DC Blocking
IR
25nA
50µA
TJ = 25к
TJ = 150к
Voltage
See Fig.4
Diode Capacitance
Cd
Measured at
4pF 1.0MHz, VR=0V, see
Fig.5
Reverse Recovery
Time
Trr
4nS Note 3
Thermal Resistance
Thermal Resistance
Rthj-tp 300K/W Junction to tie-point
Rthj-a 350K/W Junction to ambient
Note:1.Lead in Glass Exemption Applied, see EU Directive Annex 5.
2.Device mounted on an FR4 printed-circuit board
3.When switched from I F=10mA to IR=60mA; RL=100Ω;
measured at IR=1mA;see Fig.7
500mW 75Volt
High-speed Diode
MINIMELF
Cathode Ma
C
B
A
DIMENSIONS
INCHES
DIM
MIN
MAX
A
.130
.146
B
.008
.016
C
.055
.059
MM
MIN
3.30
.20
1.40
MAX
3.70
.40
1.50
NOTE
∅
SUGGESTED SOLDER
PAD LAYOUT
.165
.075
.030
Revision: A
www.mccsemi.com
1 of 4
2011/01/01