BZX84C2V4_09 Datasheet, PDF (1/6 Pages) Micro Commercial Components – Silicon 350 mWatt Zener Diodes

MCC
TM
Micro Commercial Components

  omponents
20736 Marilla Street Chatsworth

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Features
Planar Die construction
350mW Power Dissipation
Zener Voltages from 2.4V - 51V
Ideally Suited for Automated Assembly Processes
BZX84C2V4
THRU
BZX84C(B)51
Silicon
350 mWatt
Zener Diodes
Mechanical Data
Case Material:Molded Plastic. UL Flammability
Classification Rating 94V-0 and MSL Rating 1
Lead Free Finish/RoHS Compliant ("P" Suffix designates
RoHS Compliant. See ordering information)
Weight: 0.008 grams (approx.)
SOT-23
A
D
CB
Maximum Ratings @ 25^oC Unless Otherwise Specified
Maximum Forward
V_F
Voltage@IF=10mA
Power Dissipation
(NoteA)
P_(AV)
Operation And
Storage
Temperature
T_J, T_STG
Peak Forward Surge
Current(NoteB)
IFSM
Thermal Resistance
(Note C)
Rthja
0.9
350
-55^oC to
+150^oC
2.0
357
V
mWatt
A
o_C/W
NOTES:
A. Mounted on 5.0mm2(.013mm thick) land areas.
B. Measured on 8.3ms, single half sine-wave or
equivalent square wave, duty cycle = 4 pulses per
minute maximum.
C. Valid provided the terminals are kept at ambient
temperature
F
E
G
H
J
K
DIMENSIONS
INCHES
DIM
MIN
MAX
A
.110
.120
B
.083
.098
C
.047
.055
D
.035
.041
E
.070
.081
F
.018
.024
G
.0005
.0039
H
.035
.044
J
.003
.007
K
.015
.020
L
.007
.020
MM
MIN
2.80
2.10
1.20
.89
1.78
.45
.013
.89
.085
.37
.20
MAX
3.04
2.64
1.40
1.03
2.05
.60
.100
1.12
.180
.51
.50
L
NOTE
Suggested Solder
Pad Layout
.031
.800
.035
.900
.079
2.000
inches
mm
*Pin Configuration - Top View
.037
.950
.037
.950
Revision: 13
www.mccsemi.com
1 of 6
2009/04/09