BZT52C5V1S-TP Datasheet, PDF (1/4 Pages) Micro Commercial Components – 200 mW Zener Diode 2.4 to 39 Volts

MCC
TM
Micro Commercial Components

  omponents
20736 Marilla Street Chatsworth

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BZT52C2V4S
THRU
BZT52C39S
Features
x Planar Die Construction
x 200mW Power Dissipation on Ceramic PCB
x General Purpose Medium Current
x Ideally Suited for Automated Assembly Processes
• Epoxy meets UL 94 V-0 flammability rating
• Moisture Sensitivity Level 1
• Lead Free Finish/RoHS Compliant("P" Suffix
designates RoHS Compliant. See ordering information)
Absolute Maximum Ratings
Symbol
P_D
T_J
T_STG
Parameter
Power dissipation
Junction Temperature
Storage Temperature Range
Rating
200
-65 to +150
-65 to +150
Unit
mW
C
к
к
H
200 mW
Zener Diode
2.4 to 39 Volts
SOD-323
A
B
E
D
Absolute Maximum Ratings
Symbol
Parameter
Rating
Unit
R_thJA
Thermal Resistance Junction to
Ambient*
625
к/W
* Device mounted on ceramic PCB: 7.6mm x 9.4mm x 0.87mm with
pad areas 25 mm²
Electrical Characteristics
Symbol
Parameter
Rating
Unit
V_F
Maximum Forward Voltage
(I_F=10mAdc)
0.9
V
G
J
DIMENSIONS
DIM
INCHES
MM
NOTE
MIN MAX MIN MAX
A .090 .107 2.30 2.70
B .063 .071 1.60 1.80
C .045 .053 1.15 1.35
D .031 .045 0.80 1.15
E .010 .016 0.25 0.40
G .004 .018 0.10 0.45
H .004 .010 0.10 0.25
J ----- .006 ----- 0.15
SUGGESTED SOLDER
PAD LAYOUT
0.074"
0.027”
0.022”
Revision: A
www.mccsemi.com
1 of 3
2011/01/01