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BCW66H_11 Datasheet, PDF (1/3 Pages) Micro Commercial Components – NPN Small Signal Transistor 330mW
MCC
TM
Micro Commercial Components
  omponents
20736 Marilla Street Chatsworth

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$ %    !"#
Features
Lead Free Finish/RoHS Compliant ("P" Suffix designates
RoHS Compliant. See ordering information)
Ideally Suited for Automatic Insertion
150oC Junction Temperature
Low Current, Low Voltage
Epitaxial Planar Die Construction
Epoxy meets UL 94 V-0 flammability rating
Moisure Sensitivity Level 1
Mechanical Data
Case: SOT-23
Terminals: Solderable per MIL-STD-202, Method 208
Marking: EH
Weight: 0.008 grams ( approx.)
Maximum Ratings @ 25oC Unless Otherwise Specified
Charateristic
Collector-Emitter Voltage
Collector-Base Voltage
Emitter-Base Voltage
Collector Current(DC)
Peak Collector Current
Base Current(DC)
Peak Base Current
Power Dissipation@Ts=79oC
Thermal Resistance, Junction to
Ambient Air
Thermal Resistance, Junction to
Soldering Point
Operating & Storage Temperature
Symbol
VCEO
VCBO
VEBO
IC
ICM
IB
IBM
Pd
Value
45
75
5
800
1000
100
200
330
Unit
V
V
V
mA
mA
mA
mA
mW
RθJA
285(1) oC/W
RθJS
215 oC/W
Tj, TSTG -55~150 oC
Notes:
(1) Mounted on FR-4 printed-circuit board
BCW66H
NPN Small
Signal Transistor
330mW
SOT-23
A
D
CB
F
E
C
B
E
G
H
J
K
DIMENSIONS
INCHES
MM
DIM
MIN
MAX
MIN
MAX
A
.110
.120
2.80
3.04
B
.083
.098
2.10
2.64
C
.047
.055
1.20
1.40
D
.035
.041
.89
1.03
E
.070
.081
1.78
2.05
F
.018
.024
.45
.60
G
.0005
.0039
.013
.100
H
.035
.044
.89
1.12
J
.003
.007
.085
.180
K
.015
.020
.37
.51
NOTE
Suggested Solder
Pad Layout
.031
.800
.035
.900
.079
2.000
inches
mm
.037
.950
.037
.950
Revision: A
www.mccsemi.com
1 of 3
2011/01/01