BCW66H Datasheet, PDF (1/2 Pages) Micro Commercial Components – NPN Small Signal Transistor 330mW

MCC

  omponents
21201 Itasca Street Chatsworth

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Features
l Ideally Suited for Automatic Insertion
l 150^oC Junction Temperature
l Low Current, Low Voltage
l Epitaxial Planar Die Construction
Mechanical Data
l Case: SOT-23, Molded Plastic
l Terminals: Solderable per MIL-STD-202, Method 208
l Marking: EH
l Weight: 0.008 grams ( approx.)
Maximum Ratings @ 25^oC Unless Otherwise Specified
Charateristic
Symbol Value Unit
Collector-Emitter Voltage
Collector-Base Voltage
Emitter-Base Voltage
V_CEO
45
V
V_CBO
75
V
V_EBO
5
V
Collector Current(DC)
Peak Collector Current
Base Current(DC)
Peak Base Current
Power Dissipation@T_s=79^oC
Thermal Resistance, Junction to
Ambient Air
Thermal Resistance, Junction to
Soldering Point
Operating & Storage Temperature
I_C
800 mA
I_CM
1000 mA
I_B
100 mA
I_BM
200 mA
P_d
330 mW
RθJA
285^{(1) o}C/W
RθJS
215 ^o_C/W
T_j, T_STG -55~150 ^oC
Notes:
(1) Mounted on FR-4 printed-circuit board
BCW66H
NPN Small
Signal Transistor
330mW
SOT-23
A
D
CB
F
E
G
H
J
K
DIMENSIONS
INCHES
DIM
MIN
MAX
A
.110
.120
B
.083
.098
C
.047
.055
D
.035
.041
E
.070
.081
F
.018
.024
G
.0005
.0039
H
.035
.044
J
.003
.007
K
.015
.020
MM
MIN
2.80
2.10
1.20
.89
1.78
.45
.013
.89
.085
.37
MAX
3.04
2.64
1.40
1.03
2.05
.60
.100
1.12
.180
.51
NOTE
Suggested Solder
Pad Layout
.031
.800
.035
.900
.079
2.000
inches
mm
.037
.950
.037
.950
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