BAV74 Datasheet, PDF(1/3 Page) NXP Semiconductors – High-speed double diode

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BAV74 Datasheet, PDF (1/3 Pages) NXP Semiconductors – High-speed double diode

MCC

TM

Micro Commercial Components

omponents

20736 Marilla Street Chatsworth

!"#

$ % !"#

BAV74

Features

â¢ Fast Switching Speed

â¢ For General Purpose Switching Applications

â¢ Surface Mount Package Ideally Suited for Automatic Insertion

â¢ Lead Free Finish/Rohs Compliant ("P"Suffix designates

RoH SCompliant. See ordering information)

x High Conductance

x Marking:JA

â¢ Epoxy meets UL 94 V-0 flammability rating

â¢ Moisture Sensitivity Level 1

C

A

A

Maximum Ratings

â¢ Operating Temperature: -55Â°C to +150Â°C

â¢ Storage Temperature: -55Â°C to +150Â°C

â¢ Maximum Thermal Resistance; 556oC/W Junction To Ambient

225mW 50 Volt Dual

Switching Diode

SOT-23

A

D

CB

F

E

Electrical Characteristics @ 25Â°C Unless Otherwise Specified

Reverse Voltage

Average Rectified

Output Current

VR

50V

IO

200mA

Power Dissipation

PD

225mW

Maximum

Instantaneous

Forward Voltage

VF

1V

IFM = 100mA;

Reverse voltage

leakage current

Typical Junction

Capacitance

Reverse Recovery

Time

IR

0.1ÂµA VR=50Volts

CJ

2 pF Measured at

1.0MHz, VR=0V

Trr

4nS IF=IR=10mA

I rr = 0.1xIR

RL=100â¦

G

H

J

K

DIMENSIONS

INCHES

DIM

MIN

MAX

A

.110

.120

B

.083

.098

C

.047

.055

D

.035

.041

E

.070

.081

F

.018

.024

G

.0005

.0039

H

.035

.044

J

.003

.007

K

.015

.020

MM

MIN

2.80

2.10

1.20

.89

1.78

.45

.013

.89

.085

.37

MAX

3.04

2.64

1.40

1.03

2.05

.60

.100

1.12

.180

.51

NOTE

Suggested Solder

Pad Layout

.031

.800

.035

.900

.079

2.000

inches

mm

.037

.950

.037

.950

Revision: A

www.mccsemi.com

1 of 3

2011/01/01

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