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| BAS70-04-TP Datasheet, PDF (1/4 Pages) Micro Commercial Components – Surface Mount Schottky Barrier Diode 200 mWatt | |||
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MCC
TM
Micro Commercial Components
omponents
20736 Marilla Street Chatsworth
!"#
$
% !"#
BAS40
THRU
BAS70
Features
SOT-23 Package For surface mount application
Protects from line to VCC and line to ground
Low forward voltage and reverse recovery characteristics
Bidirectional-low-forward available with â -04â suffix (Figure 2)
Tape & Reel EIA Standard 481.
Mechanical Data
Epoxy meets UL 94 V-0 flammability rating
Moisture Sensitivity Level 1
Halogen free available upon request by adding suffix "-HF"
Mounting Position: Any
Weight: .008 grams (approx.)
MAXIMUM RATINGS
Operating Temperature: -55oC to +125oC
Storage Temperature: -55oC to +150oC
Power Dissipation: 200 mWatts @ Tamb=25oC
Forward
Continuous
Current:
BAS40
BAS70
IFM
IFM
=200mA@ Ta =25oC
=70mA @ Ta =25oC
Surge Forward Current: 600mA @ tp<1s, Tamb=25oC
DESCRIPTION
Various configurations of Schottky barrierâ s diodes in SOT-23
package are provided for general-purpose use in high-speed
switching ,mixers and detector applications. They may also be
used for signal integrity and counteract the transmission-line
effects with (PC) board trances by clamping over/and undershoot
from signal reflections with the schottky-low-threshold voltages.
This type of termination also does not depend on matching
the transmission line characteristic impedance, making it
particularly useful where line impendance is unknown or a
variable. This methode of termination can control distortions of
clock, data, address, and control lines as well as provides a
stabilizing effect on signal jitter. It can also significantly reduce
power consumption compared to standard resistor-based
termination methods.
Surface Mount
Schottky Barrier Diode
200 mWatt
SOT-23
A
D
CB
F
E
G
H
J
K
DIMENSIONS
INCHES
DIM
MIN
MAX
A
.110
.120
B
.083
.104
C
.047
.055
D
.035
.041
E
.070
.081
F
.018
.024
G
.0005
.0039
H
.035
.044
J
.003
.007
K
.015
.020
MM
MIN
2.80
2.10
1.20
.89
1.78
.45
.013
.89
.085
.37
MAX
3.04
2.64
1.40
1.03
2.05
.60
.100
1.12
.180
.51
NOTE
Suggested Solder
Pad Layout
.031
.800
.035
.900
.079
2.000
inches
mm
.037
.950
.037
.950
Revision: B
www.mccsemi.com
1 of 4
2013/01/01
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