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| BAS21WS Datasheet, PDF (1/2 Pages) Micro Commercial Components – High Voltage Switching Diode | |||
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MCC
TM
Micro Commercial Components
omponents
20736 Marilla Street Chatsworth
!"#
$
% !"#
BAS21WS
Fea. tures
⢠F. or Surface Mount Application.
⢠Device Marking: JS
⢠Epoxy meets UL 94 V-0 flammability rating
⢠Moisture Sensitivity Level 1
x F. or Surface Mount Application.
⢠Lead Free Finish/RoHS Compliant("P" Suffix
designates RoHS Compliant. See ordering information)
High Voltage
Switching Diode
Maximum Ratings
Symbol
Rating
VR
Continuous Reverse Voltage
IF
Peak Forward Current
IFM(surge) Peak Forward Surge Current
Thermal Characteristics
Value
250
200
625
Unit
Vdc
mAdc
mAdc
Symbol
PD
Characteristic
Total Device Dissipation FR-5
Board *, TA=25OC
Derate above 25OC
Max
Unit
200
mW
1.57 mW/OC
RJA
Thermal Resistance Junction to
Ambient
635
OC/W
TJ, TSTG
Junction and Storage Temperature
Range
-55 to
+155
OC
Electrical Characteristics @ 25OC Unless Otherwise Specified
Symbol
Characteristic
Min Max Unit
Off Characteristics
IR Reverse Voltage Leakage Current
(VR=200Vdc)
---
(VR=200Vdc, TJ=150OC)
---
V(BR) Reverse Breakdown Voltage
(IBR=100uAdc)
250
VF Forward Voltage
(IF=100mAdc)
---
(I F=200mAdc)
---
CD Diode Capacitance
(VR=0, f=1.0MHz)
---
trr Reverse Recovery Time
(IF=IR=30mAdc, RL=100 OHM) ---
0.1 uAdc
100
--- Vdc
1000 mVdc
1250
5.0 pF
50 ns
C
H
DIM
A
B
C
D
E
G
H
J
SOD-323
A
B
E
D
G
DIMENSIONS
INCHES
MM
MIN MAX MIN MAX
.090 .107 2.30 2.70
.063 .071 1.60 1.80
.045 .053 1.15 1.35
.031 .045 0.80 1.15
.010 .016 0.25 0.40
.004 .018 0.10 0.45
.004 .010 0.10 0.25
----- .006 ----- 0.15
SUGGESTED SOLDER
PAD LAYOUT
0.074"
J
NOTE
*FR-5 Minimum Pad
0.027â
0.022â
Revision: A
www.mccsemi.com
1 of 2
2011/01/01
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